1. Out of the Box

The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal and power solutions. They incorporate monolithic integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost and improved performance in powering state-of-the-art systems.

This page will guide you through the process of setting up and using the FRDM665SPIEVB board.

1.1 Kit Content and Packing List

The FRDM665SPIEVB contents include:

MC33665A SPI EVB, SPI to four transformer physical layer (TPL) interface EVB
One TPL daisy chain cable; two-wire twisted pair daisy chain interface cable
Power cable
Quick Start Guide

Mark as complete:1.1 Kit Content and Packing List

1.2 Additional Hardware

In addition to the kit contents, the following hardware is necessary or beneficial when working with this board.

External dual power supply 10 V to 18 V/2 A (optional)
EVBs of battery cell controller (BCC) devices from NXP
S32K344EVB-Q172 evaluation and development board for S32K344 from NXP
14 cell battery pack or a battery emulator, such as BATT-14CEMULATOR

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NextGet Hardware

2. Get Hardware

2.1 Board Features

Request SPI
Response SPI
Onboard analog termination for daisy chain communication to BCC devices
Configurable VIO voltage
Configurable VDD5V from internal and external supply
DIP switch for configuring the SPI of MC33665A to operate with or without crystals
Reset switch for the device and board
LED display for the status of power
Connectors to interface directly with S32K344EVB launchpad
Connectors for external interface to general-purpose input/output (GPIO) and I²C-bus

Note: Contact NXP engineering team for using TPL auto-wake function in FRDM665SPIEVB/MC33665A.

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2.2 Board Description

The FRDM665SPIEVB serves as a hardware evaluation tool in support of the MC33665A device of NXP. The MC33665A is a gateway router that can route TPL messages from the MCU to four different TPL ports. It is designed for use in both automotive and industrial applications. The device can route both TPL2 and TPL3 messages. The FRDM665SPIEVB is an ideal board for rapid prototyping of the MC33665A for SPI interface to the MCU.

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2.3 Board Components

Overview of the FRDM665SPIEVB board.

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PreviousOut of the Box

NextConfigure Hardware

3. Configure Hardware

FRDM665SPIEVB can be configured as a stacked board to S32K344EVB.

3.1 Stacked Board Configuration

As shown in Figure 1, the FRDM665SPIEVB and the S32K344EVB can be connected and stacked for communication (dual SPI) and power interface. Power can be supplied to the FRDM665SPIEVB with K3 connector from the S32K344EVB. External power supply to FRDM665SPIEVB with J6 connector is optional. Check the power LEDs D15 and D14 during this setup or configuration. In case it is not glowing, check the jumper settings at J8 and J13. Jumpers J8 and J13 must be connected appropriately to have VDD5V and VIO to MC33665A from S32K344EVB.

For stacked board configuration, you must remove the four plastic holders placed on four corners of the FRDM665SPIEVB.

Figure 1. Board interface connections.

Mark as complete:3.1 Stacked Board Configuration

3.2 External Board Configuration

FRDM665SPIEVB can be interfaced with external microcontroller boards for SPI and GPIO interface of the MC33665A. Connect 12 V at J6 or external 5 V to J11 interface. Select the 5 V to MC33665A with jumper J8. Care should be taken in selecting the right VIO for both external microcontroller board and FRDM665SPIEVB. Jumper J13 can be used to select the right VIO for the MC33665A. Before powering up the boards, crosscheck the VIO selection for the microcontroller board and FRDM665SPIEVB. Care must be taken for the interconnection wires of request SPI and response SPI from the external MCU to the board to FRDM665SPIEVB. It must be twisted pair with short GND wires interconnecting the boards (FRDM665SPIEVB and MCU).