SPC5744PGK1AMMM9 (Active)

2 x e200Z4 cores in LS, 200 MHz, 2.5MB Flash, 384kB SRAM, MAPBGA 257, 1 x FlexRay, 1 x Ethernet, –40°C to +125°C

  • Package
  • LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

Buy Options

  • SPC5744PGK1AMMM9
    935325066557
  • Active
  • TRAY-Tray, Bakeable, Multiple in Drypack
    Min. Package Quantity: 152
    Lead Time: 16 weeks
    • Distributor
    • .
  • 10K @ US $9.28

Operating Characteristics

Parameter Value
Flash (kB)
RAM (kB)
Core Type
Core: Number of cores (SPEC)
Operating Frequency [Max (MHz)]
CAN
SPI
Ambient Operating Temperature (Min to Max) (℃)
Supply voltage [max] (V)
Supply voltage [min] (V)

Quality Information

Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C°) Maximum Time at Peak Temperatures (s)
Lead Free Soldering Lead Free Soldering Lead Free Soldering
40

Shipping Information

Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US)

Product Change Notification

Part Number / 12NC Issue Date Effective Date PCN Title