ID and Description | Vendor ID | Format | Size K | Rev # | Date Last Modified |
AN1107 — Understanding RF Data Sheet Parameters | NXP | 642 | 0 | 11/20/1991 | |
AN139A — Understanding Transistor Response Parameters | NXP | 240 | 0 | 7/20/1993 | |
AN1526 — RF Power Device Impedances: Practical Considerations Application Note | NXP | 2070 | 0 | 12/31/1991 | |
AN1617 — Mounting Recommendations for Copper Tungsten Flanged Transistors Application Note | NXP | 82 | 0 | 3/19/1997 | |
AN1696 — Broadband Intermodulation Performance Development Using the Rohde and Schwarz Vector Network Analyzer ZVR | NXP | 301 | 0 | 8/16/1999 | |
AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages | NXP | 889 | 3 | 5/13/2009 | |
AN1977 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 | NXP | 110 | 0 | 10/09/2003 | |
AN1987 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 | NXP | 108 | 1 | 5/12/2004 | |
AN215A — RF Small Signal Design Using Two-Port Parameters | NXP | 274 | 0 | 7/20/1993 | |
AN267 — Matching Network Designs with Computer Solutions | NXP | 324 | 0 | 7/20/1993 | |
AN282A — Systemizing RF Power Amplifier Design | NXP | 240 | 0 | 7/20/1993 | |
AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages | NXP | 8024 | 0 | 6/07/2006 | |
AN3789 — Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages | NXP | 403 | 0 | 3/12/2009 | |
AN419 — UHF Amplifier Design Using Data Sheet Design Curves Application Note | NXP | 326 | 0 | 12/31/1993 | |
AN548A — Microstrip Design Techniques for UHF Amplifiers Application Note | NXP | 259 | 0 | 7/20/1993 | |
AN721 — Impedance Matching Networks Applied to RF Power Transistors Application Note | NXP | 612 | 1.1 | 10/18/2005 | |
AN923 — 800 MHz Test Fixture Design Application Note | NXP | 183 | 0 | 7/20/1993 | |
AN955 — A Cost Effective VHF Amplifier for Land Mobile Radios | NXP | 386 | 0 | 7/20/1993 |