Ultra-Thin Contactless Chip Module MOB10

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Product Details

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Features

  • Thin and flexible inlays for 600μm eDatapage or eCover
  • Enables additional security layers and is optimized for polycarbonate technology
  • Improved robustness and product quality
  • High production efficiency building on proven MOB platforms
  • Total package thickness: 200 μm
  • Leadframe thickness: 35 μm
  • Improved leadframe material with Ag plating
  • Compatible to MOB4/6 production lines

Design Resources

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Documentation

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