MIMX8DX5AVLFZAC

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NXP Semiconductors
Product content declaration of MIMX8DX5AVLFZAC		Last Revision (GMT): Wednesday, 26 August 2026, 02:39:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
MIMX8DX5AVLFZAC	SOT1916	FBGA609	8286.006000 mg	Halogen Free (Cl+Br)	Yes	Yes	Yes	Tin/Silver (Sn/Ag)	Other	e2	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 804 17557	2023-11-24	H	3 / 168 hours	260	40 sec.	Not Applicable	Not Applicable	Not Applicable	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Cap	Copper Alloy	Copper and its compounds	Copper, metal	7440-50-8	1899.007861	99.940000	22.918253
		Inorganic compounds	Oxygen	7782-44-7	1.140089	0.060000	0.013759
			Subtotal		1900.147950	100.0000000	22.932013
	Nickel Plating	Nickel and its compounds	Nickel, metal	7440-02-0	1.901479	99.970000	0.022948
		Phosphorus compounds	Phosphorus, elemental (not containing red allotrope)	7723-14-0	0.000571	0.030000	0.000007
			Subtotal		1.902050	100.0000000	0.022955

Epoxy Adhesive 1	Epoxy Adhesive	Inorganic Silicon compounds	Quartz	14808-60-7	5.820000	30.000000	0.070239
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.940000	10.000000	0.023413
		Organic Silicon compounds	Cyclotetrasiloxane-2-propanoic acid, .alpha.,2,4,6,6,8-hexamethyl-, 3-(trimethoxysilyl) propyl ester	113684-56-3	0.970000	5.000000	0.011706
		Organic Silicon compounds	Silicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane	68584-83-8	0.970000	5.000000	0.011706
		Organic Silicon compounds	Siloxanes and silicones, di-Me, vinyl group-terminated	68083-19-2	9.700000	50.000000	0.117065
			Subtotal		19.400000	100.0000000	0.234130

Epoxy Adhesive 2	Epoxy Adhesive	Inorganic Silicon compounds	Quartz	14808-60-7	22.800000	40.000000	0.275163
		Organic Silicon compounds	Dimethylvinylated and trimethylated silica	68988-89-6	8.550000	15.000000	0.103186
		Organic Silicon compounds	Siloxanes and silicones, di-Me, vinyl group-terminated	68083-19-2	25.650000	45.000000	0.309558
			Subtotal		57.000000	100.0000000	0.687907

Heat Spreader	Heat Spreader	Copper and its compounds	Copper, metal	7440-50-8	1844.953000	98.450000	22.265890
		Nickel and its compounds	Nickel, metal	7440-02-0	29.047000	1.550000	0.350555
			Subtotal		1874.000000	100.0000000	22.616445

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Semiconductor Die 4	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Semiconductor Die 5	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Semiconductor Die 6	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	117.698000	98.000000	1.420443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.402000	2.000000	0.028989
			Subtotal		120.100000	100.0000000	1.449432

Solder Ball - Lead Free 1	Solder Ball - Lead Free	Silver and its compounds	Silver, metal	7440-22-4	5.295500	3.500000	0.063909
		Tin and its compounds	Tin, metal	7440-31-5	146.004500	96.500000	1.762061
			Subtotal		151.300000	100.0000000	1.825970

Solder Ball - Lead Free 2	Solder Ball - Lead Free	Aluminum and its compounds	Aluminum, metal	7429-90-5	0.003703	0.003200	0.000045
		Antimony and its compounds	Antimony, metal	7440-36-0	0.014464	0.012500	0.000175
		Arsenic and its compounds	Arsenic, metal	7440-38-2	0.008678	0.007500	0.000105
		Bismuth and its compounds	Bismuth, metal	7440-69-9	0.021753	0.018800	0.000262
		Cadmium and its compounds	Cadmium, metal	7440-43-9	0.001504	0.001300	0.000018
		Copper and its compounds	Copper, metal	7440-50-8	0.007290	0.006300	0.000088
		Gold and its compounds	Gold, metal	7440-57-5	0.007290	0.006300	0.000088
		Indium and its compounds	Indium, metal	7440-74-6	0.007290	0.006300	0.000088
		Inorganic compounds	Sulfur	7704-34-9	0.001157	0.001000	0.000014
		Iron and its compounds	Iron, metal	7439-89-6	0.014464	0.012500	0.000175
		Lead and its compounds	Lead, metallic lead and lead alloys	7439-92-1	0.036217	0.031300	0.000437
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003703	0.003200	0.000045
		Phosphorus compounds	Phosphorus, elemental (not containing red allotrope)	7723-14-0	0.007290	0.006300	0.000088
		Silver and its compounds	Silver, metal	7440-22-4	4.050081	3.500200	0.048879
		Tin and its compounds	Tin, metal	7440-31-5	111.522918	96.381400	1.345919
		Zinc and its compounds	Zinc, metal	7440-66-6	0.002198	0.001900	0.000027
			Subtotal		115.710000	100.0000000	1.396451

Substrate 1	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	343.819730	99.980000	4.149402
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.068778	0.020000	0.000830
			Subtotal		343.888508	100.0000000	4.150232
	Solder	Copper and its compounds	Copper, metal	7440-50-8	0.086996	0.500000	0.001050
		Silver and its compounds	Silver, metal	7440-22-4	0.521974	3.000000	0.006300
		Tin and its compounds	Tin, metal	7440-31-5	16.790150	96.500000	0.202633
			Subtotal		17.399119	100.0000000	0.209982
	Solder Mask	Barium and its compounds	Barium sulfate	7727-43-7	5.948963	25.000000	0.071795
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	2.379585	10.000000	0.028718
		Organic compounds	Other organic compounds.		1.189793	5.000000	0.014359
		Polymers	Plastic: EP - Epoxide, Epoxy		14.277513	60.000000	0.172309
			Subtotal		23.795854	100.0000000	0.287181
	Substrate Build Up	Epoxy Resins	Bisphenol A diglycidyl ether	1675-54-3	8.698878	10.450000	0.104983
		Epoxy Resins	Phenolic Polymer Resin, Epikote 155	9003-36-5	8.698878	10.450000	0.104983
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	34.837134	41.850000	0.420433
		Polymers	Plastic: EP - Epoxide, Epoxy		31.007963	37.250000	0.374221
			Subtotal		83.242853	100.0000000	1.004620
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	192.285833	50.000000	2.320609
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	76.914333	20.000000	0.928244
		Polymers	Plastic: EP - Epoxide, Epoxy		115.371500	30.000000	1.392366
			Subtotal		384.571666	100.0000000	4.641219

Substrate 2	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	304.624700	99.990000	3.676376
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.030465	0.010000	0.000368
			Subtotal		304.655166	100.0000000	3.676743
	Solder 1	Copper and its compounds	Copper, metal	7440-50-8	0.010661	0.500000	0.000129
		Silver and its compounds	Silver, metal	7440-22-4	0.063967	3.000000	0.000772
		Tin and its compounds	Tin, metal	7440-31-5	2.057616	96.500000	0.024832
			Subtotal		2.132245	100.0000000	0.025733
	Solder 2	Copper and its compounds	Copper, metal	7440-50-8	1.270392	99.300000	0.015332
		Tin and its compounds	Tin, metal	7440-31-5	0.008955	0.700000	0.000108
			Subtotal		1.279347	100.0000000	0.015440
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.025544	0.050000	0.000308
		Barium and its compounds	Barium sulfate	7727-43-7	12.261262	24.000000	0.147976
		Epoxy Resins	Acrylated Epoxy Resin		31.419483	61.500000	0.379187
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	5.108859	10.000000	0.061657
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		2.196809	4.300000	0.026512
		Non-Halogenated Organic Compounds - Specific	2-Methyl-4'-(methylthio)-2-morpholino propiophenone	71868-10-5	0.076633	0.150000	0.000925
			Subtotal		51.088590	100.0000000	0.616565
	Substrate Build Up	Epoxy Resins	1,6-Bis(2,3-epoxypropoxy) naphthalene	27610-48-6	2.139068	2.000000	0.025815
		Epoxy Resins	Other Epoxy resins		9.625807	9.000000	0.116169
		Epoxy Resins	Phenolic Polymer Resin, Epikote 155	9003-36-5	2.139068	2.000000	0.025815
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	67.380648	63.000000	0.813186
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		9.625807	9.000000	0.116169
		Phenols and Phenolic Resins	1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol	25917-04-8	8.556273	8.000000	0.103262
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	2.139068	2.000000	0.025815
		Polymers	Butyl acrylate-ethyl acrylate-methyl methacrylate copolymer	25767-43-5	5.347671	5.000000	0.064539
			Subtotal		106.953409	100.0000000	1.290771
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	193.394621	50.000000	2.333991
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	77.357849	20.000000	0.933596
		Polymers	Plastic: EP - Epoxide, Epoxy		116.036773	30.000000	1.400394
			Subtotal		386.789243	100.0000000	4.667982

Substrate 3	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	133.313003	99.990000	1.608893
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.013333	0.010000	0.000161
			Subtotal		133.326336	100.0000000	1.609054
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	151.886560	99.990000	1.833049
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.015190	0.010000	0.000183
			Subtotal		151.901750	100.0000000	1.833232
	Solder Ball	Copper and its compounds	Copper, metal	7440-50-8	0.016492	0.500000	0.000199
		Silver and its compounds	Silver, metal	7440-22-4	0.098953	3.000000	0.001194
		Tin and its compounds	Tin, metal	7440-31-5	3.182993	96.500000	0.038414
			Subtotal		3.298438	100.0000000	0.039807
	Solder Mask	Barium and its compounds	Barium sulfate	7727-43-7	59.930014	23.500000	0.723268
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	39.528307	15.500000	0.477049
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		12.751067	5.000000	0.153887
		Polymers	Plastic: EP - Epoxide, Epoxy		142.811949	56.000000	1.723532
			Subtotal		255.021338	100.0000000	3.077735
	Substrate Build Up	Epoxy Resins	Bisphenol A diglycidyl ether	1675-54-3	4.725360	3.850000	0.057028
		Epoxy Resins	Bisphenol F diglycidyl ether	2095-03-6	4.725360	3.850000	0.057028
		Epoxy Resins	Phenolic Polymer Resin, Epikote 155	9003-36-5	1.890144	1.540000	0.022811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	55.697876	45.380000	0.672192
		Polymers	Plastic: EP - Epoxide, Epoxy		55.697875	45.380000	0.672192
			Subtotal		122.736614	100.0000000	1.481252
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	99.994752	50.000000	1.206791
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	39.997901	20.000000	0.482716
		Polymers	Plastic: EP - Epoxide, Epoxy		59.996851	30.000000	0.724074
			Subtotal		199.989504	100.0000000	2.413581
	Via Plugging	Calcium and its compounds	Calcium-carbonate	471-34-1	0.908987	52.360400	0.010970
		Epoxy Resins	Phenolic Polymer Resin, Epikote 155	9003-36-5	0.128665	7.411500	0.001553
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009029	0.520100	0.000109
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.388079	22.354500	0.004684
		Polymers	Plastic: EP - Epoxide, Epoxy		0.301260	17.353500	0.003636
			Subtotal		1.736020	100.0000000	0.020951

Substrate 4	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	162.068591	99.990000	1.955931
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.016209	0.010000	0.000196
			Subtotal		162.084800	100.0000000	1.956127
	Solder	Copper and its compounds	Copper, metal	7440-50-8	0.006464	0.500000	0.000078
		Silver and its compounds	Silver, metal	7440-22-4	0.038784	3.000000	0.000468
		Tin and its compounds	Tin, metal	7440-31-5	1.247552	96.500000	0.015056
			Subtotal		1.292800	100.0000000	0.015602
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.014786	0.050000	0.000179
		Barium and its compounds	Barium sulfate	7727-43-7	7.097472	24.000000	0.085656
		Epoxy Resins	Acrylated Epoxy Resin		18.187272	61.500000	0.219494
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	2.957280	10.000000	0.035690
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271630	4.300000	0.015347
		Non-Halogenated Organic Compounds - Specific	2-Methyl-4'-(methylthio)-2-morpholino propiophenone	71868-10-5	0.044359	0.150000	0.000535
			Subtotal		29.572800	100.0000000	0.356901
	Substrate Build Up	Epoxy Resins	Bisphenol A diglycidyl ether	1675-54-3	18.369274	3.850000	0.221690
		Epoxy Resins	Bisphenol F diglycidyl ether	2095-03-6	18.369274	3.850000	0.221690
		Epoxy Resins	Phenolic Polymer Resin, Epikote 155	9003-36-5	7.347710	1.540000	0.088676
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	216.518871	45.380000	2.613067
		Polymers	Plastic: EP - Epoxide, Epoxy		216.518871	45.380000	2.613067
			Subtotal		477.124000	100.0000000	5.758190
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	68.962800	50.000000	0.832280
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	27.585120	20.000000	0.332912
		Polymers	Plastic: EP - Epoxide, Epoxy		41.377680	30.000000	0.499368
			Subtotal		137.925600	100.0000000	1.664561

Thermally Conductive Gel 1	Thermally Conductive Gel	Aluminum and its compounds	Aluminum, metal	7429-90-5	8.712000	72.000000	0.105141
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.242000	2.000000	0.002921
		Organic Silicon compounds	Proprietary Material-Other siloxanes and silicones		0.968000	8.000000	0.011682
		Zinc and its compounds	Zinc oxide	1314-13-2	2.178000	18.000000	0.026285
			Subtotal		12.100000	100.0000000	0.146029

Thermally Conductive Gel 2	Thermally Conductive Gel	Aluminum and its compounds	Aluminum, metal	7429-90-5	16.233000	70.000000	0.195909
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.695700	3.000000	0.008396
		Organic Silicon compounds	Dimethyl,methyl hydrogen siloxane	68037-59-2	0.231900	1.000000	0.002799
		Organic Silicon compounds	Polysiloxanes, di-Me, hydrogen-terminated	70900-21-9	0.231900	1.000000	0.002799
		Organic Silicon compounds	Siloxanes and silicones, di-Me, vinyl group-terminated	68083-19-2	2.319000	10.000000	0.027987
		Zinc and its compounds	Zinc oxide	1314-13-2	3.478500	15.000000	0.041980
			Subtotal		23.190000	100.0000000	0.279869

Underfill 1	Underfill	Epoxy Resins	Other Epoxy resins		5.752500	39.000000	0.069424
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	8.850000	60.000000	0.106807
		Inorganic compounds	Carbon Black	1333-86-4	0.014750	0.100000	0.000178
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.132013	0.895000	0.001593
		Polymers	Poly[Trifluoropropyl(methyl)siloxane]	63148-56-1	0.000737	0.005000	0.000009
			Subtotal		14.750000	100.0000000	0.178011

Underfill 2	Underfill	Epoxy Resins	Other Epoxy resins		5.499000	39.000000	0.066365
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	8.460000	60.000000	0.102100
		Inorganic compounds	Carbon Black	1333-86-4	0.014100	0.100000	0.000170
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.126195	0.895000	0.001523
		Polymers	Poly[Trifluoropropyl(methyl)siloxane]	63148-56-1	0.000705	0.005000	0.000008
			Subtotal		14.100000	100.0000000	0.170166

			Total		8286.006000	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 MIMX8DX5AVLFZAC Product content declaration of MIMX8DX5AVLFZAC		上次修订 Last Revision (GMT): Wednesday, 26 August 2026, 02:39:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)	邻苯二甲酸二正丁酯(DBP)	邻苯二甲酸二异丁酯(DIBP)	邻苯二甲酸丁基苄酯(BBP)	邻苯二甲酸二（2-乙基）己酯(DEHP)
盖子 Cap	铜合金 Copper Alloy	O	O	O	O	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive 1	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive 2	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O	O	O	O	O
散热片 Heat Spreader	散热片 Heat Spreader	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 4	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 5	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
半导体芯片 Semiconductor Die 6	半导体芯片 Semiconductor Die	O	O	O	O	O	O	O	O	O	O
焊锡球-无铅 Solder Ball - Lead Free 1	焊锡球-无铅 Solder Ball - Lead Free	O	O	O	O	O	O	O	O	O	O
焊锡球-无铅 Solder Ball - Lead Free 2	焊锡球-无铅 Solder Ball - Lead Free	O	O	O	O	O	O	O	O	O	O
基板 Substrate 1	铜箔 Copper Foil	O	O	O	O	O	O	O	O	O	O
	焊料 Solder	O	O	O	O	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O	O	O	O	O
基板 Substrate 2	铜箔 Copper Foil	O	O	O	O	O	O	O	O	O	O
	焊料 Solder 1	O	O	O	O	O	O	O	O	O	O
	焊料 Solder 2	O	O	O	O	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O	O	O	O	O
基板 Substrate 3	铜箔 Copper Foil	O	O	O	O	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O	O	O	O	O
	焊锡球 Solder Ball	O	O	O	O	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O	O	O	O	O
	有机基质通道堵塞 Via Plugging	O	O	O	O	O	O	O	O	O	O
基板 Substrate 4	铜箔 Copper Foil	O	O	O	O	O	O	O	O	O	O
	焊料 Solder	O	O	O	O	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O	O	O	O	O
导热凝胶 Thermally Conductive Gel 1	导热凝胶 Thermally Conductive Gel	O	O	O	O	O	O	O	O	O	O
导热凝胶 Thermally Conductive Gel 2	导热凝胶 Thermally Conductive Gel	O	O	O	O	O	O	O	O	O	O
底注 Underfill 1	底注 Underfill	O	O	O	O	O	O	O	O	O	O
底注 Underfill 2	底注 Underfill	O	O	O	O	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注：该半导体产品具有无限期的环保使用期限（EFUP）。 Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of MIMX8DX5AVLFZAC		Last Revision (GMT): Wednesday, 26 August 2026, 02:39:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Cap	C1100	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026
	NI PLATING	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026
Epoxy Adhesive 1		Test Report 13 Aug 2025	Test Report 13 Aug 2025	Test Report 13 Aug 2025	Test Report 13 Aug 2025
Epoxy Adhesive 2		Test Report 10 Feb 2026	Test Report 10 Feb 2026	Test Report 10 Feb 2026	Test Report 10 Feb 2026
Heat Spreader	CU	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026
	NI PLATING	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026	Test Report 29 Apr 2026
Semiconductor Die 1		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Semiconductor Die 2		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Semiconductor Die 3		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Semiconductor Die 4		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Semiconductor Die 5		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Semiconductor Die 6		Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026	Test Report 30 Jan 2026
Solder Ball - Lead Free 1		Test Report 19 Dec 2025	Test Report 19 Dec 2025	Test Report 19 Dec 2025	Test Report 19 Dec 2025
Solder Ball - Lead Free 2		Test Report 8 Jun 2026	Test Report 8 Jun 2026	Test Report 8 Jun 2026	Test Report 8 Jun 2026
Substrate 1	CU FOIL	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	E700GR	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	GX-13	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025
	SOLDER MASK	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025
	SOP	Test Report 6 Aug 2024	Test Report 6 Aug 2024	Test Report 6 Aug 2024	Test Report 6 Aug 2024
Substrate 2	CU FOIL	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	E700GR	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	GXT31	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025
	SAC305	Test Report 13 Jan 2026	Test Report 13 Jan 2026	Test Report 13 Jan 2026	Test Report 13 Jan 2026
	SOLDER 1	Test Report 23 Feb 2026	Test Report 23 Feb 2026	Test Report 23 Feb 2026	Test Report 23 Feb 2026
	SOLDER MASK	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025
Substrate 3	CU FOIL	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	CU PLATING	Test Report 19 Dec 2024	Test Report 19 Dec 2024	Test Report 19 Dec 2024	Test Report 19 Dec 2024
	E700G	Test Report 21 Nov 2025	Test Report 28 Nov 2024	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	GXT31	Not Available	Not Available	Not Available	Not Available
	IR-6P	Test Report 17 Oct 2025	Test Report 17 Oct 2025	Test Report 17 Oct 2025	Test Report 17 Oct 2025
	SOLDER BALL	Test Report 29 Mar 2024	Test Report 29 Mar 2024	Test Report 29 Mar 2024	Test Report 29 Mar 2024
	SOLDER MASK	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025
Substrate 4	ABF-GX92	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025	Test Report 24 Dec 2025
	CU FOIL	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	E700GR	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025	Test Report 21 Nov 2025
	SOLDER	Test Report 16 Sep 2025	Test Report 16 Sep 2025	Test Report 16 Sep 2025	Test Report 16 Sep 2025
	SOLDER MASK	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025	Test Report 3 Nov 2025
Thermally Conductive Gel 1		Test Report 28 Jul 2026	Test Report 28 Jul 2026	Test Report 28 Jul 2026	Test Report 28 Jul 2026
Thermally Conductive Gel 2		Test Report 28 Jul 2026	Test Report 28 Jul 2026	Test Report 28 Jul 2026	Test Report 28 Jul 2026
Underfill 1		Test Report 2 Jul 2026	Test Report 2 Jul 2026	Test Report 2 Jul 2026	Test Report 2 Jul 2026
Underfill 2		Test Report 2 Jul 2026	Test Report 2 Jul 2026	Test Report 2 Jul 2026	Test Report 2 Jul 2026
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer