MIMX8QX2AVLFZAC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8QX2AVLFZACLast Revision (GMT):
Saturday, 02 March 2024, 12:04:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8QX2AVLFZACSOT1916FBGA6093133.627000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 805 285572023-11-2493 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-722.80000040.0000000.727591
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-68.55000015.0000000.272847
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-225.65000045.0000000.818540
Subtotal57.000000100.00000001.818979
LidLidCopper and its compoundsCopper, metal7440-50-81896.27400198.45000060.513711
Nickel and its compoundsNickel, metal7440-02-029.8550001.5500000.952730
Subtotal1926.129000100.000000061.466441
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3117.69800098.0000003.755967
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.4020002.0000000.076652
Subtotal120.100000100.00000003.832619
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.2955003.5000000.168989
Tin and its compoundsTin, metal7440-31-5146.00450096.5000004.659281
Subtotal151.300000100.00000004.828271
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8313.97423699.98000010.019515
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0628070.0200000.002004
Subtotal314.037044100.000000010.021520
Solder 1Copper and its compoundsCopper, metal7440-50-80.0089550.7000000.000286
Tin and its compoundsTin, metal7440-31-51.27039299.3000000.040541
Subtotal1.279347100.00000000.040826
Solder 2Copper and its compoundsCopper, metal7440-50-80.0106610.5000000.000340
Silver and its compoundsSilver, metal7440-22-40.0639673.0000000.002041
Tin and its compoundsTin, metal7440-31-52.05761696.5000000.065662
Subtotal2.132245100.00000000.068044
Solder MaskBarium and its compoundsBarium sulfate7727-43-712.77214825.0000000.407583
Inorganic Silicon compoundsSilica, vitreous60676-86-05.10885910.0000000.163033
Organic compoundsOther organic compounds.2.5544295.0000000.081517
PolymersPlastic: EP - Epoxide, Epoxy30.65315460.0000000.978201
Subtotal51.088590100.00000001.630334
Substrate Build UpEpoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-62.1925452.0500000.069968
Epoxy ResinsBisphenol A diglycidyl ether1675-54-32.7380072.5600000.087375
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.7380072.5600000.087375
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-65.4974055.1400000.175433
Inorganic Silicon compoundsSilicon dioxide7631-86-971.55183166.9000002.283355
PolymersPlastic: EP - Epoxide, Epoxy22.23561420.7900000.709581
Subtotal106.953409100.00000003.413087
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3188.70368350.0000006.021894
Inorganic Silicon compoundsSilica, vitreous60676-86-075.48147320.0000002.408757
PolymersPlastic: EP - Epoxide, Epoxy113.22221030.0000003.613136
Subtotal377.407365100.000000012.043787
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-58.71200072.0000000.278016
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.21000010.0000000.038613
Zinc and its compoundsZinc oxide1314-13-22.17800018.0000000.069504
Subtotal12.100000100.00000000.386134
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-08.46000060.0000000.269975
Inorganic compoundsCarbon Black1333-86-40.0141000.1000000.000450
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1269000.9000000.004050
PolymersPlastic: EP - Epoxide, Epoxy5.49900039.0000000.175484
Subtotal14.100000100.00000000.449958
Total3133.627000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8QX2AVLFZAC
Product content declaration of MIMX8QX2AVLFZAC
上次修订 Last Revision (GMT):
Saturday, 02 March 2024, 12:04:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8QX2AVLFZACLast Revision (GMT):
Saturday, 02 March 2024, 12:04:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
LidC1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor DieTest Report
2 Feb 2023
Test Report
2 Feb 2023
Test Report
2 Feb 2023
Test Report
2 Feb 2023
Solder Ball - Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateBUILD UPNot AvailableNot AvailableNot AvailableNot Available
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CORENot AvailableNot AvailableNot AvailableNot Available
SOLDER 1Not AvailableNot AvailableNot AvailableNot Available
SOLDER 2Not AvailableNot AvailableNot AvailableNot Available
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.