EINDHOVEN, THE NETHERLANDS, May 14, 2012 (MARKETWIRE via COMTEX) --NXP Semiconductors N.V. (NASDAQ: NXPI) today announcedparticipation in the following upcoming events with the financialcommunity.
-- Barclays Capital Global Technology, Media and Telecommunications Conference on May 22, 2012 in New York City, NY-- Credit Suisse Future of Payments Conference on June 5, 2012 in San Francisco, CA
Interested parties can listen to a live audio webcast of eventsavailable on NXP's website, www.nxp.com. A replay of each webcastwill be made available within 24 hours of the presentation.
About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI)provides High Performance Mixed Signal and Standard Product solutionsthat leverage its leading RF, Analog, Power Management, Interface,Security and Digital Processing expertise. These innovations are usedin a wide range of automotive, identification, wirelessinfrastructure, lighting, industrial, mobile, consumer and computingapplications. A global semiconductor company with operations in morethan 25 countries, NXP posted revenue of $4.2 billion in 2011.Additional information can be found by visiting www.nxp.com.
Forward-looking Statements This document includes forward-lookingstatements which include statements regarding NXP's businessstrategy, financial condition, results of operations, and marketdata, as well as any other statements which are not historical facts.By their nature, forward-looking statements are subject to numerousfactors, risks and uncertainties that could cause actual outcomes andresults to be materially different from those projected. Thesefactors, risks and uncertainties include the following: market demandand semiconductor industry conditions; the ability to successfullyintroduce new technologies and products; the end-market demand forthe goods into which NPX's products are incorporated; the ability togenerate sufficient cash, raise sufficient capital or refinancecorporate debt at or before maturity; the ability to meet thecombination of corporate debt service, research and development andcapital investment requirements; the ability to accurately estimatedemand and match manufacturing production capacity accordingly orobtain supplies from third-party producers; the access to productioncapacity from third-party outsourcing partners; any events that mightaffect third-party business partners or NXP's relationship with them;the ability to secure adequate and timely supply of equipment andmaterials from suppliers; the ability to avoid operational problemsand product defects and, if such issues were to arise, to correctthem quickly; the ability to form strategic partnerships and jointventures and to successfully cooperate with alliance partners; theability to win competitive bid selection processes to developproducts for use in customers' equipment and products; the ability tosuccessfully establish a brand identity; the ability to successfullyhire and retain key management and senior product architects; and,the ability to maintain good relationships with our suppliers. Inaddition, this document contains information concerning thesemiconductor industry and NXP's business segments generally, whichis forward-looking in nature and is based on a variety of assumptionsregarding the ways in which the semiconductor industry, NXP's marketsegments and product areas may develop. NXP has based theseassumptions on information currently available, if any one or more ofthese assumptions turn out to be incorrect, actual market results maydiffer from those predicted. While NXP does not know what impact anysuch differences may have on its business, if there are suchdifferences, its future results of operations and its financialcondition could be materially adversely affected. Readers arecautioned not to place undue reliance on these forward-lookingstatements, which speak to results only as of the date the statementswere made. Except for any ongoing obligation to disclose materialinformation as required by the United States federal securities laws,NXP does not have any intention or obligation to publicly update orrevise any forward-looking statements after we distribute thisdocument, whether to reflect any future events or circumstances orotherwise. For a discussion of potential risks and uncertainties,please refer to the risk factors listed in our SEC filings. Copies ofour SEC filings are available from on our Investor Relations website,www.nxp.com/investor or from the SEC website, www.sec.gov.
SOURCE: NXP Semiconductors