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The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal and power solutions. They incorporate monolithic integrated circuits (ICs) and system-in-package (SiP) devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost and improved performance in powering state-of-the-art systems.
This page guides you through the process of setting up and using the EVBMA7318-SPI evaluation board.
The EVBMA7318-SPI kit contents include:
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No additional hardware is required for device evaluation, however a power supply 24 voltage direct current (VDC) with current capability of 500 mA or a four-to-18-cell battery pack is recommended. In addition to the kit contents, the following (optional) hardware is beneficial when working with this kit:
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This evaluation board requires a Windows PC. Verifying that your system meets the minimum specifications (Windows® 11/10/8/7, Windows XP, or Vista in 32-bit or 64-bit version ) will ensure reliable performance while using this evaluation board.
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Software must be installed before working with this evaluation board. Install the following programs:
All listed software is available on the evaluation board's information page at EVBMA7318-SPI or from NXP GUI page SWBMS-ScriptGUI-D.
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The EVBMA7318-SPI evaluation board features the following:
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This board includes one BMA7318 device. As shown in the diagram, the board communicates with a controller board or controller PC through SPI and communicates with other cell monitoring unit (CMU) boards through TPL with transformer isolation. Each board measures lithium-ion batteries with four to 18 cells. The board operates from a nine VDC to 90 VDC power source.
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Figure 2 identifies important components on the board and Table 1 provides additional details on these components.
Table 1. Evaluation board featured components location.
| Number | Devices | Description |
|---|---|---|
| 1 | BMA7318FAIAE | 18-Channel Li-ion battery cell controller IC |
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Table 2. J1-high-voltage connector.
| Pin | Name | Description |
|---|---|---|
| 1 | NC | No connect |
| 2 | NTC7 | Should connect to an external NTC resistor for temperature sensing |
| 3 | NTC6 | Should connect to an external NTC resistor for temperature sensing |
| 4 | NTC5 | Should connect to an external NTC resistor for temperature sensing |
| 5 | NTC4 | Should connect to an external NTC resistor for temperature sensing |
| 6 | NTC3 | Should connect to an external NTC resistor for temperature sensing |
| 7 | NTC2 | Should connect to an external NTC resistor for temperature sensing |
| 8 | NTC1 | Have connected to an internal NTC resistor for PCB temperature sensing |
| 9 | GND | Ground of BCC |
| 10 | C1P | Cell 1 voltage sensing point |
| 11 | C3P | Cell 3 voltage sensing point |
| 12 | C5P | Cell 5 voltage sensing point |
| 13 | C6Pb | Cell 6 voltage sensing point b |
| 14 | C8P | Cell 8 voltage sensing point |
| 15 | C10P | Cell 10 voltage sensing point |
| 16 | C12Pa | Cell 12 voltage sensing point a |
| 17 | C13P | Cell 13 voltage sensing point |
| 18 | C15P | Cell 15 voltage sensing point |
| 19 | C17P | Cell 17 voltage sensing point |
| 20 | PVWR | Power supply for BCC |
| 21 | NC | No connect |
| 22 | NTC8 | Should connect to an external NTC resistor for temperature sensing |
| 23 | NTC9 | Should connect to an external NTC resistor for temperature sensing |
| 24 | GND | Ground of NTC resistors |
| 25 | GND | Ground of NTC resistors |
| 26 | GND | Ground of NTC resistors |
| 27 | GND | Ground of NTC resistors |
| 28 | GND | Ground of NTC resistors |
| 29 | GND | Ground of NTC resistors |
| 30 | COM | Cell 0 voltage sensing point |
| 31 | C2P | Cell 2 voltage sensing point |
| 32 | C4P | Cell 4 voltage sensing point |
| 33 | C6Pa | Cell 6 voltage sensing point a |
| 34 | C7P | Cell 7 voltage sensing point |
| 35 | C9P | Cell 9 voltage sensing point |
| 36 | C11P | Cell 11 voltage sensing point |
| 37 | C12Pb | Cell 12 voltage sensing point b |
| 38 | C14P | Cell 14 voltage sensing point |
| 39 | C16P | Cell 16 voltage sensing point |
| 40 | C18P | Cell 18 voltage sensing point |
Table 3. J2-TPL connector.
| Pin | Name | Description |
|---|---|---|
| 1 | H_INOUT+ | Positive of TPL_H twisted wire |
| 2 | H_INOUT- | Negative of TPL_H twisted wire |
Table 4. J4-SPI connector.
| Pin | Name | Description |
|---|---|---|
| 1 | WAKEIN_CON | Wake-up input |
| 2 | CSN | SPI chip select input from controller |
| 3 | MOSI | SPI target data input from controller |
| 4 | MISO_CON | SPI target data output to controller |
| 5 | SCLK | SPI clock input from controller |
| 6 | GND | GND of SPI |
Table 5. J5-GPIO connector.
| Pin | Name | Description |
|---|---|---|
| 1 | GPIO0 | GPIO0 debug |
| 2 | GPIO9/ALARMOUT | GPIO9/ALARMOUT debug |
| 3 | GPIO1 | GPIO1 debug |
| 4 | GPIO8 | GPIO8/SPI status indication debug |
| 5 | GPIO2 | GPIO2 debug |
| 6 | GPIO7 | GPIO7/OCOUT debug |
| 7 | GPIO3 | GPIO3 debug |
| 8 | GPIO6 | GPIO6 debug |
| 9 | GPIO4 | GPIO4 debug |
| 10 | GPIO5 | GPIO5 debug |
| 11 | GND | GND of GPIO |
| 12 | GND | GND of GPIO |
Table 6. J6-ISENSE connector.
| Pin | Name | Description |
|---|---|---|
| 1 | GND | GND of NTC |
| 2 | ISENSE- | Current sense input _ Negative |
| 3 | ISENSE+ | Current sense input _ Positive |
| 4 | NTC_SHUNT | Should connect to SHUNT NTC resistor for temperature sensing |
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Figure 3 and Figure 4 present a typical hardware configuration that includes the development board, power supply and Windows PC workstation.
The setup uses ScriptGUI and requires the UMFT4222EV to connect the EVBMA7318-SPI to the controller PC. The EVBMA7318-SPI will be debugged through ScriptGUI.
This setup is suitable for EVB based on the BMA7318FAIAE. For instructions on connecting the UMFT4222EV, refer to the ScriptGUI help document (see Figure 4).
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