| Part | Package | Material Declaration | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
|---|---|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||||
| S32K344EHT1MPBST Package : HDQFP172 |
S32K344EHT1MPBST (935434685557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K344EHT1MMMST Package : LFBGA257 |
S32K344EHT1MMMST (935438574557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K342EHT0MPBST Package : HDQFP172 |
S32K342EHT0MPBST (935436145557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K342EHT0MPAST Package : HDQFP100 |
S32K342EHT0MPAST (935442944557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K341EHT0MPBST Package : HDQFP172 |
S32K341EHT0MPBST (935437411557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K341EHT0MPAST Package : HDQFP100 |
S32K341EHT0MPAST (935442927557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K324EHT1MPBST Package : HDQFP172 |
S32K324EHT1MPBST (935437129557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K324EHT1MMMST Package : LFBGA257 |
S32K324EHT1MMMST (935438573557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K322EHT0MPBST Package : HDQFP172 |
S32K322EHT0MPBST (935437513557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K322EHT0MPAST Package : HDQFP100 |
S32K322EHT0MPAST (935442943557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K314EHT1MPBST Package : HDQFP172 |
S32K314EHT1MPBST (935438572557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K314EHT1MMMST Package : LFBGA257 |
S32K314EHT1MMMST (935432209557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K312NHT0MPBST Package : HDQFP172 |
S32K312NHT0MPBST (935436148557) |
ISO 26262 | 3 | 260 | 40 | ||||
| S32K312NHT0MPAST Package : HDQFP100 |
S32K312NHT0MPAST (935438784557) |
ISO 26262 | 3 | 260 | 40 | ||||