NXP Semiconductors (NASDAQ: NXPI) today announced the availability of its
QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible
options for 802.15.4, Multiprotocol RF, and optional NFC technology.
The latest additions to its QN series of Bluetooth Low Energy (BLE) devices
enable next generation intelligent connected devices by achieving ultra-low
power consumption and integrating a high-capacity CPU with a wide operating
temperature range, a comprehensive mix of analog and digital peripherals and
BLE mesh support.
The QN9090 and QN9030 devices are powered by an Arm® Cortex®-M4 running at
48MHz and include up to 640KB onboard flash and 152 KB SRAM, providing storage
space and flexibility for complex applications and safe over-the-air (OTA)
The QN Series devices help accelerate development and time-to-market for
developers creating products with rich features for diverse IoT applications
such as personal healthcare devices, sports and fitness trackers, connected
appliances, building and home automation, toys and gaming peripherals, as well
as beacons and mesh networks.
As NXP's BLE SoC with NFC integrated on chip, the QN9090T and QN9030T variants
support out-of-band wireless communications to enable numerous use cases. By
tapping an IoT device based on the QN9090T to a smartphone, tablet or other
NFC reader device, a BLE connection can be quickly established, greatly
simplifying the pairing process. The built in NFC NTAG eliminates the need for
the tag to be powered and creates additional opportunities for diagnostics or
device commissioning in stages of the device life cycle.
NXP's commitment to longevity in the market
Low-power: Ultra-low power solution is ideal for Bluetooth, battery operated
applications, featuring 4.3mA Rx current and 7.3mA Tx current @+0dBm.
CPU with large and scalable embedded flash memory and SRAM: 48 MHz ARM
Cortext-M4, 640KB of embedded flash, and 152KB of SRAM.
Advanced integration with robust peripherals including NFC NTAG: Reduces
system board footprint and cost of manufacturing with digital and analog
Microcontroller intelligence: Rich set of MCU capabilities, including
various low power modes, digital MIC interface with wake up on audio event
and Quad SPI NOR flash memory controller for high density data or code
Standardized connectivity: 2.4GHz Bluetooth Low Energy 5.0 transceiver
supporting 2Mbps and up to 8 concurrent Bluetooth connections with antenna
Integrated power amplifiers with exceptionally high transmit power (up to
+11 dBm) to make long-distance transmission possible.
Wide temperature range: -40 ? to +125 ?, applicable in various environments.
Broad portfolio: NXP offers pin-to-pin compatible solutions for 802.15.4 and
Multiprotocol RF devices along with leading solutions across the spectrum of
NXP offers comprehensive enablement to help speed time-to-market
NXP MCUXpresso SDK for QN is compatible with the latest toolchains from IAR
and NXP's MCUXpresso IDE. The full MCUXpresso Suite of software and tools
provides a seamless software experience across NXP devices as well as a fast
path to add Bluetooth LE capability to an existing design on other NXP
devices. The NXP IoT Toolbox smart device application is available, along with
the NXP Connectivity Tool and Test Tool are to help the developers' evaluate
RF performance and test more efficiently.
Product availability and support
The QN9090 and QN9030 devices are available now from NXP and its distribution
partners. Learn more at
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and/or elsewhere. All other product or service names are the property of their
respective owners. All rights reserved. © 2020 NXP B.V.