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Glenn G. Daves

Glenn Daves

Glenn G. Daves is Vice President of Package Innovation at NXP Semiconductors. He is responsible for package design, package technology development, and assembly process development in support of NXP’s full product portfolio. Prior to its acquisition by NXP, Glenn led packaging and printed circuit board development for Freescale Semiconductor. Prior to that, he led global packaging product and technology development at the IBM Corporation. He has also held leadership positions in project management, test and burn-in engineering, and assembly manufacturing engineering. Glenn holds twenty-seven U.S. patents and has degrees from Brown University, the University of Illinois at Urbana-Champaign, and Alliance Theological Seminary. He serves on the board of trustees of Nyack College and on the National Leadership Council of World Vision U.S.