The MSC8144 processor is the third generation of our high-performance multicore DSP devices that target wireline and wireless infrastructure applications. It builds on the success of previous multicore DSPs and is designed to bolster the rapidly expanding voice/video/data triple-play services in this space. This multicore DSP delivers high levels of performance and integration, combining four fully-programmable StarCore® DSP cores, each running at up to 1 GHz with an architecture highly optimized for voice, fax, video and data compression processing.
An internal QUICC Engine® dual-RISC packet-processor supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading such processing from the DSP cores.
The MSC8144 embeds a large internal memory and supports a variety of advanced interface types, including high-speed Ethernet and UTOPIA for network communications, DDR controller for high-speed, industry-standard memory interface, multi-channel TDM interfaces for connectivity to the PSTN networks, and Serial RapidIO® and PCI interfaces for connectivity to other devices mounted on the same rack or circuit board.
As a highly flexible, fully programmable, and powerful multimedia DSP, the MSC8144 offers tremendous processing power while maintaining a competitive price and power per channel.
Archived content is no longer updated and is made available for historical reference only.
The MSC8144 device is manufactured in CMOS 90 nm SOI process technology. The device uses a 29 mm x 29 mm flip chip ball-grid array (FC-BGA) package, available with lead-free spheres.
The MSC8144 device is manufactured in CMOS 90 nm SOI process technology. The device uses a 29 mm x 29 mm flip chip ball-grid array (FC-BGA) package, available with lead-free spheres.