The BGU8062 evaluation board simplifies the RF evaluation of the BGU8062. The evaluation board enables testing the device RF performance and requires no additional support circuitry. The BGU8062 evaluation board is fabricated on a 35 mm x 20 mm x 1 mm 3-layer PCB. The 0.2 mm (8 mill) top layer uses ROGERS R4003C for optimal RF performance. The board is fully assembled with the BGU8062, including the external components. The board is supplied with two SMA connectors to connect input and output to the RF test equipment.