For best experience this site requires Javascript to be enabled. To enable on your browser, follow our accessibility instructions.

MC33662: LIN 2.1 / SAEJ2602-2, LIN Physical Layer

Overview

The NXP^® MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.

Designed to support automotive networks with Controller Area Network (CAN)
Part number selection defines the operating baud rate (33662L or 33662S for 20 kB/s and 33662J for 10 kB/s)
Both integrate a fast baud rate (100 kB/s) for test and programming modes
Provides excellent Electromagnetic Compatibility (EMC) and Radiated Emission performance, Electrostatic Discharge (ESD) robustness and safe behaviour in case of TXD short to ground

Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
Active bus wave shaping, offering excellent radiated emission performance
Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
Very high immunity against electromagnetic interference
Low standby current in Sleep mode
Over-temperature protection
Local and remote Wake-up capability reported by the RXD pin
Fast baud rate selection reported by RXD pin
5.0 V and 3.3 V compatible digital inputs without any required external components

Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
Active bus wave shaping, offering excellent radiated emission performance
Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
Very high immunity against electromagnetic interference
Low standby current in Sleep mode
Over-temperature protection
Local and remote Wake-up capability reported by the RXD pin
Fast baud rate selection reported by RXD pin
5.0 V and 3.3 V compatible digital inputs without any required external components