MC33662 | LIN 2.1 / SAEJ2602-2, LIN Physical Layer

Overview

The NXP^® MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.

Designed to support automotive networks with Controller Area Network (CAN)
Part number selection defines the operating baud rate (33662L or 33662S for 20 kB/s and 33662J for 10 kB/s)
Both integrate a fast baud rate (100 kB/s) for test and programming modes
Provides excellent Electromagnetic Compatibility (EMC) and Radiated Emission performance, Electrostatic Discharge (ESD) robustness and safe behaviour in case of TXD short to ground

Features

Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
Active bus wave shaping, offering excellent radiated emission performance
Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
Very high immunity against electromagnetic interference
Low standby current in Sleep mode
Over-temperature protection
Local and remote Wake-up capability reported by the RXD pin
Fast baud rate selection reported by RXD pin
5.0 V and 3.3 V compatible digital inputs without any required external components

Features

Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
Active bus wave shaping, offering excellent radiated emission performance
Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
Very high immunity against electromagnetic interference
Low standby current in Sleep mode
Over-temperature protection
Local and remote Wake-up capability reported by the RXD pin
Fast baud rate selection reported by RXD pin
5.0 V and 3.3 V compatible digital inputs without any required external components

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MC33662: LIN 2.1 / SAEJ2602-2, LIN Physical Layer

Overview

Features

Features

NXP^® MC33662 Internal Block Diagram

NXP^® MC33662 Product Image

NXP^® MC33662 Internal Block Diagram

NXP^® MC33662 Product Image

Development Boards and Designs

Development Boards and Designs

Target Applications

Automotive

MC33662: LIN 2.1 / SAEJ2602-2, LIN Physical Layer

Overview

Features

Features

NXP® MC33662 Internal Block Diagram

NXP® MC33662 Product Image

NXP® MC33662 Internal Block Diagram

NXP® MC33662 Product Image

Development Boards and Designs

Development Boards and Designs

Target Applications

Automotive

NXP^® MC33662 Internal Block Diagram

NXP^® MC33662 Product Image

NXP^® MC33662 Internal Block Diagram

NXP^® MC33662 Product Image