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The MSC8122 is a highly integrated system-on-a-chip that combines four StarCore® SC140 extended cores with an RS-232 serial interface, four time-division multiplexed (TDM) serial interfaces, thirty-two general-purpose timers, a flexible system interface unit (SIU), an Ethernet interface, and a multi-channel DMA controller. The four extended cores can deliver a total 4800/6400/8000 DSP MMACS performance at 300/400/500 MHz.
Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers. The MSC8122 targets high-bandwidth highly computational DSP applications and is optimized for wireless transcoding and packet telephony as well as high-bandwidth base station applications. The MSC8122 delivers enhanced performance while maintaining low power dissipation and greatly reduces system cost.
The MSC8122 device is designed to provide an optimal solution for 3G wireless base stations, to help eliminate many of the costly and power hungry ASICs and FPGAs required in today's systems for both symbol rate and for chip rate assist. In addition, the MSC8122 device allows customers to add next-generation features that efficiently use available frequencies and higher bit rates in 3G systems.
Efficient application software development is key in Our strategy to expedite customer's time-to-market. Developers can take advantage of development tools and real-time operating systems (RTOS) from NXP® and third-party suppliers. In addition NXP is partnering with third-party vendors to provide integrated systems solutions that include GSM, CDMA, TDMA, and ITU G.7xx speech coders, hybrid echo cancellation, fax, modem, and xDSL software.
Four 300/400/500 MHz StarCore® SC140 DSP extended cores
The MSC8122 device is manufactured in 90 nm process technology. The devices use a 20 mm x 20 mm Flip Chip Ball-Grid Array (FC-BGA) package, available with lead-free or lead-bearing spheres.
Availability
Contact your local Sales office for information about availability.
Four 300/400/500 MHz StarCore® SC140 DSP extended cores
The MSC8122 device is manufactured in 90 nm process technology. The devices use a 20 mm x 20 mm Flip Chip Ball-Grid Array (FC-BGA) package, available with lead-free or lead-bearing spheres.
Availability
Contact your local Sales office for information about availability.