Design Files
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Absolute, Integrated Pressure Sensor (15 to 130 kPa)
The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation for automotive, aviation, and industrial applications.
- Provides a piezoresistive transducer with state-of-the-art, monolithic, signal-conditioned, silicon pressure sensing
- Combines advanced micromachining techniques, thin-film metallization, and bipolar semiconductor processing
- Resists high-humidity conditions as well as common automotive media
- Delivers high reliability of on-chip integration in a small form factor
- Presents a logical and economical choice for system designs
Product Details
Features
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Resistant to high humidity and common automotive media
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Improved accuracy at high temperature
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1.5% maximum error over 0º to 85º C
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Ideally suited for microprocessor or microcontroller-based systems
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Temperature compensated over -40ºC to +125ºC
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Durable thermoplastic (PPS) surface mount package
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Design Resources
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
4 engineering services
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Independent Design House (IDH)
Hardware/Software Engineering Services
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Independent Design House (IDH)
Hardware/Software Engineering Services
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Independent Design House (IDH)
Embedded Software Development Services
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Original Design Manufacturer (ODM)
Hardware and Software Engineering Services
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