Semiconductor manufacturing generates hazardous, non-hazardous, office and one-time waste. Most of the waste generated from our operations is tied to the manufacturing of our products. We have waste reduction programs in place at our sites to handle and manage hazardous and non-hazardous waste in an environmentally responsible manner. Our waste reduction programs focus on increasing the percentage of waste recycled and reduce the amount of hazardous waste sent to the landfill. To continue progress toward our goal to increase our recycling rate, we continue to identify innovative ways to recycle or recover waste streams for reuse, or even convert them into sources of revenue.
For waste that requires specialized handling, we only ship to vendors equipped with the knowledge and expertise to properly reclaim, recycle, or destroy. All handling of our waste is done according to local rules and regulations. We audit the waste management vendors annually to ensure they are responsibly handling, meeting all regulatory requirements and ultimately managing the disposition of the waste with minimal impact on the environment.
Increase the recycle rate of solid waste to 90% by 2020 from a 2010 baseline.
NXP’s strategy is to continuously look for opportunities to reduce the amount of waste generated by improving yield, optimizing processes and minimizing the waste of scrap material. Some examples are:
- Continue to recycle/reuse spent materials such as collecting our sulfuric acid waste and sell to external companies that needs a lower quality feed to use for their applications.
- Identify new opportunities to recycle such as finding a recycling vendor to take our e-scrap waste and finished die to recover precious metals.
- Establish more recycling vendor possibilities in local regions. We review vendors annually and the process is to find alternative vendors that are local to that region.
- Remove single use plastic from our cafeterias, café, and pantries with sustainable and reusable alternatives.
Our total waste that we generate as an ongoing basis (operational) and those such as construction process (one-time waste) is calculated for our fabs and assembly operations in which the two will be combined and identified as total waste. We consider one-time waste as those waste streams that are generated not part of normal operations but rather generated because of unique one-off projects. Examples include: construction and roofing debris from site demolition.
In 2010, our recycling rate was 65% and in 2019 the recycling rate increased to 73%. Waste generated from operations was categorized 73% recycled, 20% landfill, and 7% incinerated. In 2019, we continued our work to better understand the process for each site and how to optimize our recycling opportunities across the globe. Many of the recycling vendors serving some locations either do not have options for specific waste streams or due to demand, are no longer able to recycle that stream. Our biggest opportunity to increase recycling is to be able to manage our waste water sludge. In some locations, there are opportunities to recycle the sludge material and in other locations there are not. We continue to search for alternative recycling vendors to increase our 2020 recycling opportunities.
2019 Total Waste
Total Waste by Method
NXP has a very proactive “reclaim” program and uses the best available technology to manage e-scrap. E-scrap is collected from factories, test centers and subcontractors around the world. The materials collected include process metallic scrap pieces, parts and fixtures, failed test devices and ICs, engineering materials, test architecture boards, chemicals, silicon in all forms and manufacturing process byproducts containing metallic components. NXP processes these materials not only to recover the value of metals and silicon, but to do so in an environmentally sound method available with minimal waste going to the landfill. The smelter captures nearly 100% of the material available for recovery.
While our products are not typically subject to recycling or e-waste laws, we work with others to identify shared solutions for our used products. We also take steps to integrate environmental considerations into the design phase of our products to minimize environmental impacts of our products at their end of life.
In 2019, NXP conducted an audit of our assembly and test facilities e-scrap program and our e-waste vendors, which provided additional opportunities to increase reclaim effectiveness. The audit’s purpose was to verify products were recycled, review, and ensure security controls were in place for asset, IP, and anti-counterfeit protection. Proper EHS methods were used in the entire e-scrap disposal process. Checks and balances were in place to make sure the material was properly crushed; split and all material was accounted for. For additional assurance, comparative analysis and internal benchmark was conducted.
Overall, there were no significant issues observed, additional improvements have been documented for program improvements. Such improvements are more frequent auditing, witnessing of the e-scrap and third-party validation of sample results. Corporate and site teams have action plans in place and will continue monitoring the program.
To make sure our products reach our customers undamaged, we use special packaging materials to protect them during shipment. We are committed to using sustainable pack-and-ship methods and using specially designed packaging tubes and shipping trays that occupy minimum space, are light in weight for shipping purposes and are easy to recycle.
We work with our packaging suppliers to drive changes in the materials that we use to ship products between our sites and our customers. Our long-term vision is to have a sustainable and closed-loop packaging program for all inbound, outbound, and return shipments.
We advise our customers on the possibilities for recycling. We know that most of our larger customers already have recycling programs in place, but we don't have accurate figures on how much of our packaging is recycled by our customers.
Our packaging uses mainly paper & cardboard (1,045 tons) and plastic (2,509 tons) in 2019. The use of wood is for the wooden pallets that ship our products. While the 2019 packaging data includes a majority of NXP sites, it does not include all. We intend to include all NXP sites in future reports.