12 A / 8 A / 15 A Core Supply Regulator with AVP and Watchdog
i.MX 937 Applications Processor: Secure, Smart, Power‑ and Cost‑Efficient, Scalable Edge AI Processing
- This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.
The i.MX 937 application processor is designed for power‑ and cost‑efficient edge AI‑driven applications, powered by the integrated eIQ® Neutron neural processing unit (NPU). It delivers 1080p60-capable graphics and video processing, vision and ML acceleration, efficient CPU performance and real‑time processing, along with advanced security through the integrated EdgeLock® secure enclave to support energy‑efficient edge computing. The processor targets automotive, industrial and commercial (IoT) applications.
Access to FRDM i.MX 937 development boards will be available in late 2026, with full silicon available in early 2027.
Product Details
Features
Multicore Processing
- 4x Arm® Cortex®‑A55 cores
- NXP eIQ® Neutron NPU
Memory
- Up to #### megatransfers per second (MT/s) x32/x16 low-power double data rate (LPDDR)5 or up to #### MT/s x32/x16
- LPDDR4X with inline error correction code (ECC) and encryption
- 3x ultra-secure digital host controller (uSDHC): secure digital (SD) 3.0; secure digital input/output (SDIO) 3.0, embedded MultiMediaCard (eMMC)5.1
- Extended serial peripheral interface (XSPI) with integrated physical layer encryption and decryption (IPED), with support for serial peripheral interface (SPI) NOR and SPI NAND memories
Connectivity
- 2x 1 GB/s Ethernet with time-sensitive networking (TSN), audio-video bridging (AVB) and IEEE 1588 for synchronization, plus energy-efficient Ethernet (EEE)
- 1x PCI Express (PCIe) Gen 3.0 (1‑lane) and 2x USB 2.0 with integrated PHY
- 2x 32‑pin FlexIO interfaces (bus or serial I/O)
- 8x universal asynchronous receiver/transmitter(UART), 8x low-power serial peripheral interface (LPSPI), 8x low-power inter‑integrated circuit (LPI2C) and 3x controller area network flexible data rate (CAN‑FD)
Packaging
- 19 x 19 mm, flip‑chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch
Temperature Range
- Automotive: ‑40 °C Ta to 125 °C Tj
- Extended industrial: ‑40 °C Ta to 125 °C Tj
- Industrial: ‑40 °C Ta to 105 °C Tj
- Commercial: 0 °C Ta to 90 °C Tj
Security
- EdgeLock® Secure Enclave (Advanced Profile), EdgeLock Prime Accelerator and post‑quantum cryptography (PQC)
