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i.MX 937 Applications Processor: Secure, Smart, Power‑ and Cost‑Efficient, Scalable Edge AI Processing
- This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.
The i.MX 937 application processor is designed for power‑ and cost‑efficient edge AI‑driven applications, powered by the integrated eIQ® Neutron neural processing unit (NPU). It delivers 1080p60-capable graphics and video processing, vision and ML acceleration, efficient CPU performance and real‑time processing, along with advanced security through the integrated EdgeLock® secure enclave to support energy‑efficient edge computing. The processor targets automotive, industrial and commercial (IoT) applications.
Access to FRDM i.MX 937 development boards will be available in late 2026, with full silicon available in early 2027.
Product Details
Features
Multicore Processing
- 4x Arm® Cortex®-A55
- 1x Arm Cortex-M7
- 1x Arm Cortex-M33
- NXP eIQ® Neutron NPU
Memory
- Up to 4500 megatransfers per second (MT/s) x32/x16 Low-Power Double Data Rate 5 (LPDDR5) or up to 3733 MT/s x32/x16 Low-Power Double Data Rate 4x (LPDDR4x); With inline error correcting code (ECC) and encryption
- 3x ultra-Secure Digital Host Controller (uSDHC): Secure Digital (SD) 3.0; Secure Digital Input/Output (SDIO) 3.0, embedded MultiMediaCard 5.1 (eMMC5.1)
- eXtended Serial Peripheral Interface (XSPI) with Integrated Physical layer Encryption and Decryption (IPED), with support for Serial Peripheral Interface (SPI) NOR and SPI NAND memories
Graphics
- 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0
- 2D GPU
Video
- Video Decode: 1080p60, h.265/4
- Video Encode: 1080p60 h.264
- JPEG Encoder/Decoder
Display Interfaces
- MIPI-DSI
- Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)
Camera Interfaces
- MIPI-CSI with PHY
Audio
- 17x I²S TDM (32-bit @ 768 kHz)
- 8 channel PDM microphone input
- MQS: Medium Quality Sound output (sigma-delta modulator)
Connectivity
- 2x 1 GB/s Ethernet with time-sensitive networking (TSN), audio-video bridging (AVB) and IEEE 1588 for synchronization, plus energy-efficient Ethernet (EEE)
- 1x PCI Express (PCIe) Gen 3.0 (1‑lane) and 2x USB 2.0 with integrated PHY
- 2x 32‑pin FlexIO interfaces (bus or serial I/O)
- 8x universal asynchronous receiver/transmitter(UART), 8x low-power serial peripheral interface (LPSPI), 8x low-power inter‑integrated circuit (LPI2C) and 3x controller area network flexible data rate (CAN‑FD)
Packaging
- 19 x 19 mm, flip‑chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch
Temperature Range
- Automotive: ‑40 °C Ta to 125 °C Tj
- Extended industrial: ‑40 °C Ta to 125 °C Tj
- Industrial: ‑40 °C Ta to 105 °C Tj
- Commercial: 0 °C Ta to 90 °C Tj
Security
- EdgeLock® Secure Enclave (Advanced Profile), EdgeLock Prime Accelerator and post‑quantum cryptography (PQC)