i.MX 93 Applications Processor Family – Arm® Cortex®-A55, ML Acceleration, Power Efficient MPU

i.MX93
  • Preproduction
  • This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative. i.MX 93 family pre-production samples and evaluation kits for a 14x14mm Automotive package (along with technical support) are available for early access customers through a paid program. For more info, please contact Beta.iMX@nxp.com for more details.

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i.MX 93 applications processors deliver efficient machine learning (ML) acceleration and advanced security with integrated EdgeLock® secure enclave to support energy-efficient edge computing.

The i.MX 93 applications processors are the first in the i.MX portfolio to integrate the scalable Arm Cortex-A55 core, bringing performance and energy efficiency to Linux®-based edge applications and the Arm Ethos™-U65 microNPU, enabling developers to create more capable, cost-effective and energy-efficient ML applications.

Optimizing performance and power efficiency for Industrial, IoT and automotive devices, i.MX 93 processors are built with NXP’s innovative Energy Flex architecture. The SoCs offer a rich set of peripherals targeting automotive, industrial and consumer IoT market segments.

Part of the EdgeVerse™ portfolio of intelligent edge solutions, the i.MX 93 family will be offered in commercial, industrial, extended industrial and automotive level qualification and backed by NXP’s product longevity program.

Register to join our upcoming launch sessions during the Embedded Vision Summit and on Hackster.io.

Product Details

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Block Diagram

i.MX 93 Processors Family

i.MX 93 Processors Family Block Diagram
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Features

Multicore Processing

  • 1-2x Arm® Cortex®-A55 @ 1.7 GHz
  • Arm Cortex-M33 @ 250Mhz
  • Arm® Ethos™ U-65 microNPU
  • EdgeLock® secure enclave

Connectivity

  • 2x USB 2.0 Type C with PHY
  • 2x Gb Ethernet: AVB and IEEE 1588 for sync, and EEE for low power. 1 with TSN
  • 2x CAN-FD
  • 8x UART, 8x I2C, 8x SPI, 2x I3C
  • 1x 4-ch, 12-bit ADC
  • 2x 32-pin FlexIO interfaces (camera, bus or serial I/O)

External Memory

  • Up to 3.7GT/s x16 LPDDR4/LPDDR4X (with Inline ECC)
  • 3x SD 3.0/ SDIO3.0/ eMMC5.1
  • 1x Octal SPI, including support for SPI NOR and SPI NAND memories

Graphics

  • Hardware Compositor for Blending/Composition, Resize, Color Space Conversion

Display Interfaces

  • 1x 1080p60 MIPI-DSI (4-lane, 1.5Gbps/lane) with PHY
  • 1x 720p60 LVDS (4-lane)
  • 24-bit parallel RGB

Camera Interfaces

  • 1x 1080p60 MIPI-CSI (2-lane, 1.5Gbps/lane) with PHY
  • 8-bit parallel YUV/RGB

Audio

  • 7x I2S TDM (32-bit @ 768KHz), SPDIF Tx/Rx
  • 8 channel PDM microphone input
  • MQS: Medium Quality Sound output (sigma-delta modulator)

Operating Systems

  • Linux® OS
  • FreeRTOS
  • Greenhills
  • QNX
  • VxWorks

Packaging

  • 11 mm x 11 mm, 0.5 mm pitch FCCSP
  • 9 mm x 9 mm, 0.5 mm pitch FCCSP
  • 14 mm x 14 mm, 0.65 mm pitch FCCSP

Temp Range

  • -40 C° to 125 C°

Documentation

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Design Resources

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  • Models

    BSDL File for i.MX 93

    ZIPRev 0Apr 19, 2023 15:26:0011.2 KBIMX93-BSDL
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  • Models

    i.MX 93 11x11 IBIS Model

    ZIPRev 0Apr 19, 2023 15:51:008.7 MBIMX93-IBIS
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Hardware

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Software

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Training

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