Instead, use the S32R294 MCUs, designed to extend the existing S32R product family that already includes the MPC5775K, S32R274 and the S32R372 devices. If you are still interested in S32R37 MCUs, please contact NXP support.
| Part | Package | Material Declaration | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
|---|---|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||||
| FS32R274VCK2VMM Package : LFBGA257 |
FS32R274VCK2VMM (935350822557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274VCK2MMM Package : LFBGA257 |
FS32R274VCK2MMM (935350821557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274VBK2VMM Package : LFBGA257 |
FS32R274VBK2VMM (935350819557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274VBK2MMM Package : LFBGA257 |
FS32R274VBK2MMM (935350818557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274KSK2MMM Package : LFBGA257 |
FS32R274KSK2MMM (935372313557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274KSK2MMMR (935372313518) |
ISO 26262 | 3 | 260 | 40 | |||||
| FS32R274KCK2VMM Package : LFBGA257 |
FS32R274KCK2VMM (935350817557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274KCK2MMM Package : LFBGA257 |
FS32R274KCK2MMM (935350816557) |
ISO 26262 | 3 | 260 | 40 | ||||
| FS32R274KBK2MMM Package : LFBGA257 |
FS32R274KBK2MMM (935350813557) |
ISO 26262 | 3 | 260 | 40 | ||||