EdgeLock® SE050: Plug & Trust Secure Element Family – Enhanced IoT security with high flexibility

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Product Details

Block Diagram

EdgeLock SE050 Chip Image

EdgeLock Plug & Trust Middleware

Features

Configurations

    EdgeLock SE050 is available in different configurations. The available features depend on the chosen configuration:

  • EdgeLock SE050E, Common Criteria (CC) certified EAL 6+ with extended range of ECC and symmetric cryptographic options
  • EdgeLock SE050F, Common Criteria (CC) EAL 6+ and FIPS certified (140-2 security level 3 for OS and applet and security level 4 for the physical security of the hardware) with support of FIPS approved algorithms
  • EdgeLock 2GO enabled for flexible credential customization and over-the-air key management to meet various application requirements

Advanced Security

  • Common Criteria EAL 6+ certified up to OS level as a safe environment to run pre-installed NXP IoT applets, supporting full encrypted communications and secured lifecycle management
  • FIPS 140-2 certified platform with security level 3 for OS and applet and security level 4 for the physical security of the hardware
  • Secured flash user memory up to 50kB
  • Secure binding with host MCU/MPU, and bus encryption
  • Secure credential injection with end-to-end encryption
  • Advanced access control policies to credentials and data stored on chip
  • Suitable for industrial IoT use cases

Cryptographic Algorithms

  • ECC cryptographic support of extended set of ECC curves, including NIST (up to 521 bits key length), Brainpool, Twisted Edwards and Montgomery
  • RSA up to 4096Bits
  • AES & 3DES encryption and decryption
  • AES modes: CBC, CTR, ECB, CCM, GCM
  • HMAC, CMAC, GMAC, SHA-1, SHA-224/256/384/512 operations
  • HKDF, MIFARE® KDF, PRF (TLS-PSK)
  • TRNG compliant to NIST SP800-90B
  • DRBG compliant to NIST SP800-90A
  • Support of main TPM functionalities

Communication

  • Contactless interface for late-stage parameter configuration of unpowered devices
  • I2C target (up to high-speed mode, 3.4 Mbit/s), I2C controller (fast-mode, 400 kbit/s)

Package

  • Small and very thin HXQFN20 package particularly suited for space limited applications (3 mm x 3 mm x 0.33 mm)

Temperature

  • Extended temperature range for industrial applications (-40 to +105 °C)

Product Programs

Product Programs

Design Resources

Documentation

Quick reference to our documentation types.

1-5 of 52 documents

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Hardware

1-5 of 8 hardware offerings

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Software

1-5 of 6 software files

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Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 8 engineering services

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To find a complete list of our partners that support this product, please see our Partner Marketplace.

Training

15 trainings

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Support

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