The High Performance Computing Platform II (HPC II) is a high-performance
server reference design which is optimized for
high speed throughput between the processor and the memory, disk drive and
Ethernet port subsystems.
HPC II is designed to the micro-ATX chassis, allowing it to
be used in a standard ATX/Micro-ATX chassis.
In addition, advanced thermal management demonstrates the low
power consumption and minimal cooling requirements needed for NXP® Semiconductors
built on Power Architecture technology.
This application note applies to the MPC7447A and MPC7448 processors embedded on an HPC II platform. It describes the implementation of an Automatic Thermal Monitoring System (ATMS) that can be used to automatically control the processor core temperature.
This document describes the design rules used for the High-Performance Computing Platform II (HPC II). Specifically it addresses issues for the design of the circuit board, such as layout, power supplies, and so forth.
NXP Semiconductors Power Architecture™
technology-based evaluation and development platforms may optionally implement a “System ID” non-volatile memory device. This device stores important configuration data about the board.
The High-Performance Computing Platform II (HPC II) is a high-performance PowerPC server reference design that is optimized for high-speed throughput between the processor and the memory, disk drive, and Ethernet port subsystems. The PowerPC processors supported by this board are as follows: MPC7448, MPC7447A, MPC7447, MPC7445, and MPC7441.
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