i.MX RT1160 Crossover MCU Dual-Core Arm® Cortex®-M7 and Cortex-M4

i.MX-RT1160
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i.MX RT1160 Crossover MCUs are dual-core devices featuring an Arm® Cortex®-M7 and Cortex-M4 for real-time performance and high integration for Industrial and IoT applications.

The i.MX RT1160 Arm® Cortex®-M7 operates at up to 600 MHz and the Arm® Cortex®-M4 up to 240 MHz with 1 MB on-chip RAM. The family offers advanced 2D graphics, MIPI-CSI, MIPI-DSI, and various memory interfaces, a wide range of connectivity interfaces including 3x Ethernet up to Gbps with TSN/AVB, UART, SPI, I²C, USB and 3x CAN. The i.MX RT1160 provides advanced embedded security including secure boot and crypto engines.

The i.MX RT1160 family is supported by the MCUXpresso ecosystem, which includes an SDK, a choice of IDEs and secure provisioning and configuration tools to enable rapid development.

Block Diagram

i.MX RT1160 Crossover MCU

i.MX RT1160 Crossover MCU
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Features

Multicore Processing

  • Arm Cortex®-M7 core up to 600 MHz and a power efficient Cortex®-M4 core up to 240 MHz

Software and Tools

  • MCUXpresso developer experience
    • Selection of IDE choices
    • Pin, clock, peripheral, security and memory config tools
    • Security programming and provisioning tools
    • Software development kit (SDK)
  • Zephyr RTOS support

Memory

  • Boot ROM (256 KB)
  • On-chip RAM (1 MB in total)
    • Configurable 512 KB RAM shared with M7 TCM
    • 256 KB RAM shared with M4 TCM
  • External memory interfaces
    • 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200
    • 8/16-bit SLC NAND FLASH

Graphics and HMI

  • Parallel RGB LCD interface (eLCDIF)
  • Parallel RGB LCD Interface Version 2 (LCDIFv2)
  • MIPI Display Serial Interface (MIPI DSI) with PHY integrated
  • SPDIF input and output
  • PDM microphone interface with 4 pairs of inputs
  • Asynchronous Sample Rate Converter (ASRC)
  • Generic 2D (PXP)
  • Vector Graphics Processing
  • Parallel Camera Sensor Interface (CSI)
  • MIPI Camera Serial Interface (MIPI CSI) with PHY integrated

Connectivity

  • Two USB 2.0 OTG controllers with integrated PHY interfaces
  • Two Ultra Secure Digital Host Controller (uSDHC) interfaces with eMMC 5.0 and SD/SDIO 3.0 compliance
  • One 10M/100M Ethernet controller with support for IEEE1588
  • One Gigabit Ethernet controller with support for AVB
  • Twelve universal asynchronous receiver/transmitter (UARTs) modules
  • Six I²C modules
  • Six SPI modules
  • Three FlexCAN (with Flexible Data-rate supported) modules
  • Two EMV SIM modules

Analog

  • Two Analog-Digital-Converters (ADC), which supports both differential and single-end inputs
  • One Digital-Analog-Converter (DAC)
  • Four Analog Comparators (ACMP)

Packaging

  • 289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch

Temperature and Qualifications

  • Temperature Range Options (Tj)
  • Consumer: 0 to + 95 °C
  • Industrial: -40 to +105 °C
  • Extended Industrial: -40 to +125 °C

Buy/Parametrics

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Documentation

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Application Note (66)

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