i.MX 8ULP Applications Processor Family

i.MX8ULP

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Block Diagram

i.MX8ULP Applications Processors

i.MX8ULP Applications Processors Block Diagram

Features

CPU

  • Up to two Arm® Cortex®-A35 @ 800 MHz
  • Arm Cortex-M33 @ 216 MHz
  • Cadence® Tensillica® Hi-Fi 4 DSP @475 MHz for advanced audio, voice and ML processing and Fusion DSP @200 MHz for low-power voice and sensor hub processing
  • EdgeLock secure enclave
  • RISC-V powered Power Management Subsystem (µpower)

Memory

  • 896 KB Total On Chip SRAM

External Memory

  • LPDDR3/LPDDR4/LPDDR4X
  • SPI-NOR
  • SPI-NAND

Graphics

  • 3D GPU includes: Open GL® ES 3.1, OpenCL, Vulkan® and Open VG1.1
  • 2D GPU
  • MIPI DSI (4-lane) with PHY
    • Up-to 24-bit RGB (DBI/DPI)
  • Color EPD Display

Connectivity

  • 10/100 Ethernet
  • FlexCAN

Display/Camera

  • MIPI CSI (2-lane) with PHY
  • (ISI) module interfaces: 1 pixel link source to obtain the image data for processing in its pipeline channels

Packaging

  • FCCSP 9.4 X 9.4 mm2
  • MAPBGA 15 x 15 mm2

Temperature Range

  • Industrial (-40°C to 105°C)
  • Commercial (0°C to 95°C)

Part numbers include: MIMX8UD3CVP08SC, MIMX8UD3DVK08SC, MIMX8UD3DVP08SC, MIMX8UD5CVP08SC, MIMX8UD5DVK08SC, MIMX8UD5DVP08SC, MIMX8UD7CVP08SC, MIMX8UD7DVK08SC, MIMX8UD7DVP08SC, MIMX8US3CVP08SC, MIMX8US3DVK08SC, MIMX8US3DVP08SC, MIMX8US5CVP08SC, MIMX8US5DVK08SC, MIMX8US5DVP08SC.

Documentation

Quick reference to our documentation types.

1-5 of 21 documents

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Hardware

4 hardware offerings

Software

2 software files

Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 23 engineering services

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To find a complete list of our partners that support this product, please see our Partner Marketplace.

Training

3 trainings

Support

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