Low-cost, low-power Arm926EJ-S™ MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller

LPC3130FET180
  • Not Recommended for New Designs
  • This page contains information on a product that is not recommended for new designs.

The NXP® LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3130/3131 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.

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Product Details

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Block Diagram

Block diagram: LPC3130FET180, LPC3131FET180

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Features

CPU platform

  • 180 MHz, 32-bit ARM926EJ-S
  • 16 kB D-cache and 16 kB I-cache
  • Memory Management Unit (MMU)

Internal memory

  • 96 kB (LPC3130) or 192 kB (LPC3131) embedded SRAM

External memory interface

  • NAND flash controller with 8-bit ECC
  • 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM

Communication and connectivity

  • High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY
  • Two I²S-bus interfaces
  • Integrated leader/follower SPI
  • Two leader/follower I²C-bus interfaces
  • Fast UART
  • Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
  • Four-channel 10-bit ADC
  • Integrated 4/8/16-bit 6800/8080 compatible LCD interface

System functions

  • Dynamic clock gating and scaling
  • Multiple power domains
  • Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
  • DMA controller
  • Four 32-bit timers
  • Watchdog timer
  • PWM module
  • Random Number Generator (RNG)
  • General Purpose I/O (GPIO) pins
  • Flexible and versatile interrupt structure
  • JTAG interface with boundary scan and Arm® debug access

Operating voltage and temperature

  • Core voltage: 1.2 V
  • I/O voltage: 1.8 V, 2.8 V, 3.3 V
  • Temperature: -40 Cel to +85 Cel
  • TFBGA180 package: 12 x 12 mm², 0.8 mm pitch

Documentation

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Design Resources

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Design Files

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2 design files

  • Models

    IBIS models for LPC3130 and LPC3131 pkg TFBGA-180

    ZIPRev 1Jun 13, 2017125.5 KBIBISLPC3130_LPC3131_TFBGA-180
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  • Models

    BSDL for LPC313x and LPC314x pkg TFBGA

    ZIPRev 1Jun 13, 20175.6 KBBSDL_LPC313X-LPC314X-TFBGA
    Download

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