Design Files
2 design files
-
Models
IBIS models for LPC3130 and LPC3131 pkg TFBGA-180
-
Models
BSDL for LPC313x and LPC314x pkg TFBGA
Low-cost, low-power Arm926EJ-S™ MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller
LPC3131FET180 Receive alerts
- Not Recommended for New Designs
- This page contains information on a product that is not recommended for new designs.
The NXP® LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3130/3131 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.
sot570-3_3d
Product Details
Features
CPU platform
- 180 MHz, 32-bit ARM926EJ-S
- 16 kB D-cache and 16 kB I-cache
- Memory Management Unit (MMU)
Internal memory
- 96 kB (LPC3130) or 192 kB (LPC3131) embedded SRAM
External memory interface
- NAND flash controller with 8-bit ECC
- 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
Communication and connectivity
- High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY
- Two I²S-bus interfaces
- Integrated leader/follower SPI
- Two controller/target I²C-bus interfaces
- Fast UART
- Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
- Four-channel 10-bit ADC
- Integrated 4/8/16-bit 6800/8080 compatible LCD interface
System functions
- Dynamic clock gating and scaling
- Multiple power domains
- Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
- DMA controller
- Four 32-bit timers
- Watchdog timer
- PWM module
- Random Number Generator (RNG)
- General Purpose I/O (GPIO) pins
- Flexible and versatile interrupt structure
- JTAG interface with boundary scan and Arm® debug access
Operating voltage and temperature
- Core voltage: 1.2 V
- I/O voltage: 1.8 V, 2.8 V, 3.3 V
- Temperature: -40 Cel to +85 Cel
- TFBGA180 package: 12 x 12 mm², 0.8 mm pitch
Documentation
Quick reference to our documentation types.
1-5 of 11 documents
-
Application Note
Using the LCD interface in the LPC313x/LPC314x/LPC315x devices
-
Application Note
UUencoding for UART ISP
-
Application Note
PCB layout guidelines for NXP® MCUs in BGA packages
-
Application Note
Programming and booting from NAND flash on the EA3100