Digital LLC+PFC Combo Controller for Resonant Power Supply

Roll over image to zoom in

Block Diagram

TEA2016AAT Block diagram

TEA2016AAT Block diagram

Features

Key Features

  • Complete functionality of LLC and PFC controller in single small-size SO16 package
  • Integrated high-voltage start-up
  • Integrated drivers and high-voltage level shifter (LS)
  • High-side driver directly supplied from the low-side driver output
  • Accurate boost voltage regulation
  • Integrated X-capacitor discharge without additional external components
  • Power good function
  • Several parameters can easily be configured, like:
    • Operating frequencies to be outside the audible area at all operating modes
    • Soft start and soft stop in burst mode, reducing the audible noise
    • Accurate transition levels between operation modes (high-power mode/low-power mode/burst mode)

Green Features

  • Valley/zero voltage switching for minimum switching losses
  • High efficiency from low load to high load
  • Compliant with the latest energy-saving standards and directives (Energy Star, EuP)
  • Excellent no-load input power (< 75 mW for TEA2016AAT/TEA1995T combination)

Protection Features

  • Independently configurable levels and timers
  • All protections can independently be set to latch, safe restart, or latch after several attempts to restart
  • Supply undervoltage protection (UVP)
  • Overpower protection (OPP)
  • Internal and external overtemperature protection (OTP)
  • Capacitive mode regulation (CMR)
  • Accurate overvoltage protection (OVP)
  • Overcurrent protection (OCP)
  • Inrush current protection (ICP)
  • Brownin/brownout protection
  • Disable input

NXP GreenChip

  • This product is part of the NXP GreenChip portfolio, this program optimizes for energy efficiency in mobile and computing applications, specializing in high-power density, safety and reliability.

Improvements of TEA2016AAT/2 vs. TEA2016AAT/1

Product Process Used for the High Voltage Die Features Supporting Information
TEA2016AAT/1 EZHV (Silicon On Insulator) Reference Behavior Comparison
TEA2016AAT/2 ABCD3HV+ (Silicon On Insulator)
  • Better noise immunity for high dv/dt
  • The /2 operation is much more robust to high half bridge dv/dt events

Buy/Parametrics










































































































Documentation

Quick reference to our documentation types

10 documents

Compact List

Application Note (1)
Application Note Software (1)
Data Sheet (2)
Fact Sheet (3)
User Guide (3)

Design Files

Hardware

Quick reference to our board types.

1-5 of 8 hardware offerings

Show All

Software

Quick reference to our software types.

5 software files

  • Application Example Software

    LLC Resonant Converter Design Tool

  • BSPs and Device Drivers

    Ringo v135 TEA2016ATT x86 for 32-Bit Windows OS

    Account Required
  • BSPs and Device Drivers

    Ringo v135 TEA2016ATT x64 for 64-Bit Windows OS

    Account Required
  • BSPs and Device Drivers

    Ringo v141 TEA2016ATT x86 for 32-Bit Windows OS

    Account Required
  • BSPs and Device Drivers

    Ringo v141 TEA2016ATT x64 for 64-Bit Windows OS

    Account Required

Note: For better experience, software downloads are recommended on desktop.

Training

2 trainings

Support

What do you need help with?