2.4/5 GHz Dual-Band 1x1 Wi-Fi® 4 (802.11n) + Bluetooth® 5.2 Solution
2.4/5 GHz Dual-Band 1x1 Wi-Fi® 6 (802.11ax) and Bluetooth® 5.4 + 802.15.4 Tri-Radio Solution
The IW612 is a highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6, Bluetooth®/Bluetooth Low Energy (LE) 5.4 and 802.15.4 tri-radio single-chip solution optimized for a broad array of IoT and industrial applications including:
IW612 includes a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency and improved range upon the standards of previous generations of Wi-Fi. The Wi-Fi subsystem integrates a Wi-Fi media access control (MAC), baseband and direct-conversion radio with integrated power amplifier (PA), low-noise amplifier (LNA) and transmit/receive switch removing the need for an radio frequency (RF) front-end module (FEMs) saving cost and reducing system complexity.
In addition to a Wi-Fi 6 radio, the IW612 integrates an independent Bluetooth 5.4 and 802.15.4 subsystem that supports Thread, Zigbee and Dual personal area network (PAN) mesh networks. The device features Bluetooth Profiles such as hands free (HFP), advanced audio distribution profile (A2DP) for audio streaming as well as additional profiles like dual wideband speech (WBS). As for Bluetooth LE, the IW612 enables 2 Mbit/s high-speed data rate, long range and extended advertising. Finally, LE Audio is supported using Isochronous channels for a better overall audio experience.
The IW612 integrates dedicated CPUs and memories for both the Wi-Fi and Bluetooth/802.15.4 subsystems, which enable real time, independent protocol processing. Interfaces for connecting the IW612 to external host processors include secure digital input output (SDIO) 3.0 for Wi-Fi, universal asynchronous receiver-transmitter (UART) for Bluetooth and serial peripheral interface (SPI) for 802.15.4.
Wireless modules based on the NXP IW612 are offered by leading module manufacturers.
Product Details
Block Diagram
Choose a diagram:
Features
Wi-Fi Key Performance
- 1x1 2.4/5 GHz, up to 80 MHz channel
- Uplink/downlink (UL/DL), multi-user multiple-input multiple-output (MU-MIMO) and orthogonal frequency-division multiple access (OFDMA)
- Target wake time (TWT), dual carrier modulation (DCM) and extended range (ER)
- 802.11az accurate ranging
- Wi-Fi protected access 3 (WPA3) security
- SDIO 3.0 host interface
Bluetooth Capabilities
- Supports Bluetooth 5.2 features
- Bluetooth 5.4 certified
- Integrated high power PA up to +20 dBm transmit power
- Full-featured Bluetooth baseband
- Synchronous connection oriented (SCO) / extended synchronous connection oriented (eSCO) links with hardware accelerated audio signal processing
- Bluetooth LE 2 Mbit/s, Long Range, Advertising Extensions
- LE Audio with Isochronous Channels
- UART host interface
802.15.4 Connectivity
- IEEE 802.15.4 compliant supporting Thread, Zigbee and Dual PAN in 2.4 GHz band
- Integrated high power PA up to +20 dBm transmit power
- Shared transmitter and antenna pin with Bluetooth
- Simultaneous receive with Bluetooth
- SPI host interface
Support
- Dedicated, independent CPUs and memories for Wi-Fi and Bluetooth
- Efficient power management system supporting deep‑sleep/low‑power mode
- Single‑ and dual‑antenna configurations
Partner Modules
IW612
Wi-Fi 6 (802.11ax) 5.2 + 802.15.4 Tri-Radio Solution GHz Dual-Band 1x1 + Bluetooth® 5.1| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
AW-PU600 |
- | - | 0 to 70 | MHF4 connector(s) | 1 | OSM-L | 45 x 45 | CE, FCC, IC, Japan | i.MX93 |
|
AW-XH320 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SiP | 8 x 8 x 1.35 | NA | i.MX / i.MX RT |
|
AW-XM549 |
SDIO | UART | 0 to 70 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX 93, RT1060 |
|
AW-XM549-I |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX 93, RT1060 |
|
CMP9612-9-R |
SDIO | UART | -40 to 85 | RF PIN | 1 | SMD | 12 x 12 x 2 | N/A | i.MX 93, RT1060 |
|
CMP9612-2C-R |
SDIO | UART | -40 to 85 | u.FL | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-2-R |
SDIO | UART | -40 to 85 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-1C-R |
SDIO | UART | 0 to 70 | U.FL Connector(s) | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-1-R |
SDIO | UART | 0 to 70 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
LBES5PL2EL-923 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 8.8 x 7.7 x 1.3 | CE, FCC, IC, MIC (Japan) | i.MX 93, RT1060 |
|
ENWF9511C1KF |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 15.3 x 12 x 2.5 | EU, CE RED, FCC, ISED | i.MX 93, RT1060 |
|
M2-MAYA-W260-00C |
SDIO | UART, PCM/I²S | -40 to 85 | U.FL Connectors | 2 | M.2 card | 22.0 x 30.0 x 2.8 | AEC-Q104 subset; FCC/ISED, RED/UKCA, BTSIG | i.MX 6/7/8/9/RT |
|
M2-MAYA-W271-00C |
SDIO | UART, PCM/I²S | -40 to 85 | U.FL Connectors | 2 | M.2 card | 22.0 x 30.0 x 2.8 | AEC-Q104 subset; FCC/ISED, RED/UKCA, BTSIG | i.MX 93, RT1060 |
|
MAYA-W271-00B |
SDIO | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 2 | SMD | 10.4 x 14.3 x 1.9 | AEC-Q104 subset; FCC/ISED, RED/UKCA, GITEKI, NCC, KCC, ANZ, BTSIG | i.MX 93, RT1060 |
|
MAYA-W276-00B |
SDIO | UART, PCM/I²S | -40 to 85 | Emb. Antenna / pin | 1 | SMD | 10.4 x 14.3 x 1.9 | AEC-Q104 subset; FCC/ISED, RED/UKCA, GITEKI, NCC, KCC, ANZ, BTSIG | i.MX 93, RT1060 |
|
FGS060N |
SDIO | UART, PCM/I²S | -40 to 85 | Emb. Antenna / pin | 1 | SMD | 13.0 x 14.0 x 2.0 | N/A | i.MX / i.MX RT |
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Documentation
Quick reference to our documentation types
1-10 of 39 documents
Compact List
Application Note (24)
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AN14463: Antenna Diversity[AN14463]
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AN14365: RF Test Mode on Android OS[AN14365]
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Dual PAN on IW612[AN14782]
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Wake on Wi-Fi[AN14465]
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Kconfig Memory Optimizer[AN14634]
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Bluetooth Direct Test Mode (DTM)[AN14163]
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802.11kvr Roaming[AN14212]
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Coexistence Overview for IW612[AN13382]
Brochure (1)
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Smart Cooking with Matter[MATTER-SMART-COOKING-BR]
Data Sheet (1)
Fact Sheet (1)
Reference Manual (1)
User Manual (11)
Design Resources
Hardware
Quick reference to our
board types.
1-5 of 8 hardware offerings
-
Evaluation and Development BoardsMCU / RTOS Hosted Matter Development Platform
-
Evaluation and Development BoardsIW612, IW611, AW611 Evaluation Kit
Active -
Evaluation and Development Boardsi.MX 8ULP Evaluation Kit
-
Additional hardware available. View our featured partner solutions.
-
Evaluation and Development BoardsFRDM i.MX 93 Development Board
Active -
Evaluation and Development BoardsFRDM i.MX 95 Development Board
Active
Software
Quick reference to our software types.
5 software files
-
HMI Design Software
GUI Guider
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BSPs and Device Drivers
STM32 CMSIS PACK driver
-
BSPs and Device Drivers
STM32 CMSIS PACK driver
-
Additional software available. View our featured partner solutions.
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BSPs and Device Drivers
STM32 CMSIS PACK driver
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Examples and Quick Start Software
MCUXpresso Software Development Kit (SDK)
Note: For better experience, software downloads are recommended on desktop.
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
1-5 of 8 engineering services
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Independent Design House (IDH)
Hardware Engineering
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Independent Design House (IDH)
Linux, FreeRTOS and Windows Embedded Support Services
-
Independent Design House (IDH)
Design review
-
Independent Design House (IDH)
Elektrobit DLE Digital Life Experience
-
Independent Design House (IDH)
Design Services
To find additional partner offerings that support this product, visit our Partner Marketplace.
Training
2 trainings