i.MX 6SoloX Processors - Heterogeneous Processing with Arm® Cortex®-A9 and Cortex-M4 Cores

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Block Diagram

i.MX 6SoloX Applications Processor Block diagram

i.MX 6SoloX Applications Processor Block diagram

Features

CPU Complex

  • 1x Cortex-A9 up to 1 GHz
    • 256 KB L2 cache
    • 32 KB instruction and data caches
    • NEON SIMD media accelerator
  • 1x Cortex-M4 up to 200 MHz
    • 16 KB instruction and data caches
    • 64 KB TCM
    • MPU and FPU

Multimedia

  • GPU 2D/3D
    • Vivante GC400T
    • 17Mtri/s 133Mpxl/s Open GL ES 2.0
  • Camera Interface
    • 24-bit parallel CMOS sensor interface
    • NTSC/PAL analog video input interface
  • PiXel Processing Pipeline (PXP)
    • Image re-sizing, rotation, overlay and CSC

Memory

  • DDR
    • 16/32-bit DDR3-800 and DDR3L-800
    • 16/32-bit LPDDR2-800
  • NAND
    • SLC/MLC, 62-bit ECC, ONFI2.2
    • NOR
    • 2x DDR Quad SPI
    • 16/32-bit NOR Flash

Connectivity

  • 2x 10/100/1000 Ethernet
    • Hardware AVB for traffic shaping and enhanced packet prioritization
    • Support for IEEE®1588
  • PCIe 2.0 (1 lane)
  • 2x 8ch 12-bit ADC
  • 3x USB 2.0 ports
    • 2x HS OTG + PHY
    • 1x HS Host HSIC
  • 4x SD/MMC 4.5
  • 5x SPI, 6x UART, 4x I²C, 5x I2S/SSI
  • FlexCAN
  • MLB 25/50

Display

  • Parallel RGB
  • LVDS

Advanced Power Management

  • Partial PMU integration
  • NXP® PF0200 PMIC

Security

  • Multicore unit includes for multi-core isolation and sharing
  • Resource Domain Controller (RDC)
  • Secure Messaging Unit (MU)
  • Hardware Semaphores
  • High Assurance Boot, cryptographic cipher engines, random number generator, and tamper detection

Package and Temperature

  • 19 x 19 mm 0.8 mm BGA
  • 17 x 17 mm 0.8 mm BGA (two ball map options)
  • 14 x 14 mm 0.65 mm BGA
  • Extended Commercial (-20C to +105C)
  • Industrial (-40C to +105C)
  • Automotive (-40C to +125C), AEC-Q100

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