i.MX 6QuadPlus Processor - Quad-Core, High-Performance, Advanced 3D Graphics, HD Video, Advanced Multimedia, Arm® Cortex®-A9 Core

i.MX6QP

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The i.MX 6QuadPlus family delivers dramatic graphics and memory performance enhancements and are pin-compatible with a broad range of i.MX 6 processors. This device encompasses a quad-core Arm® Cortex®-A9 platform running up to 1.2 GHz* with 1 MB of L2 cache, advanced graphics, prefetch and resolve engine, and optimized 64-bit DDR3 or 2-ch., 32-bit LPDDR2 support. Integrated FlexCAN, MLB busses, PCI Express® and SATA-2 provide excellent connectivity, while integration of LVDS, MIPI display port, MIPI camera port and HDMI v1.4 makes it an ideal multicore platform for a leading-edge consumer, automotive and industrial multimedia applications which require higher graphics performance.

Visit www.nxp.com/imx6tools for the latest software and tools.

* 1.0 GHz available now. For 1.2 GHz, contact NXP® for availability.

i.MX 6 applications processors are part of NXP's EdgeVerse™ edge computing platform.

Product Details

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Block Diagram

i.MX 6QuadPlus Multimedia Applications Processor Block Diagram

i.MX 6QuadPlus Multimedia Applications Processor Block Diagram
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Features

CPU Complex

  • 4x Arm® Cortex®-A9 up to 1.2 GHz per core
  • 1 MB L2 cache
  • 32 KB instruction and data caches
  • NEON SIMD media accelerator

Multimedia

  • Embedded prefetch and resolve engine
  • GPU 3D
    • Vivante GC2000
    • 200Mtri/s 1000Mpxl/s, OpenGL® ES 3.0 and Halti, OpenCL™ 1.1 EP
  • GPU 2D(Vector Graphics)
    • Vivante GC355
    • 300Mpxl/s, OpenVG™ 1.1
  • GPU 2D(8-layer Composition)
    • Vivante GC320
    • 600Mpxl/s, BLIT
  • Video Decode
    • HD (1080p + 720p) 30fps
  • Video Encode
    • HD 1080p 30fps
  • Camera Interface
    • Types: 1x 20-bit parallel, MIPI-CSI2 (4 lanes), three simultaneous inputs

Memory

  • 512KB OCRAM
  • DDR
    • Significant increase in 64-bit memory bus performance, and memory interfaces support DDR3, DDR3L and LP-DDR2 at 533 MHz
      • 2x32 LP-DDR2, 1x64 DDR3 / DDR3L

Connectivity

  • Four USB 2.0
    • 1x HS USB 2.0 OTG + PHY
    • 1x HS USB 2.0 Host + PHY
    • 2x HS USB 2.0 Host (HSIC)
  • Ethernet
    • 1 Gbps + IEEE®1588
  • Expansion Ports
    • 4x eMMC 4.5 / SD 3.0
    • 5x SPI, 5x UART, 3x I²C
    • PCIe 2.0 (1 lane)

Display

  • 2x QXGA (2048x1536)
  • or 2x WXGA (1280 x 720)

Advanced Power Management

  • PMU integration
  • NXP PF0100F9 power management unit

Security

Advanced security supporting:
  • High Assurance Boot
  • Cryptographic cipher engines
  • Random number generator
  • Tamper-resistant RTC

Package and Temperature

  • 21 x 21mm, 0.8 mm BGA
  • Consumer (-20C to +105C), up to 1.2 GHz*
  • Industrial (-40C to +105C), up to 800 MHz
  • Automotive (-40C to +125C), AEC-Q100, up to 1 GHz

Design Resources

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