i.MX 6SoloX Applications Processors | Arm® Cortex®-A9, Cortex-M4

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As the first device utilizing both the Arm^® Cortex^®-A9 and Cortex-M4 cores, the i.MX 6SoloX applications processor offers a highly integrated multi-market solution.

Enables secure, connected homes and vehicles within the Internet of Things (IoT)
Delivers secure and robust implementation to enable concurrent execution of multiple software environments
Provides for an application-rich system with real-time responsiveness
Maintains maximum effectiveness and security when portioning system resources such as memory and peripherals
Backed by a strong enablement ecosystem for better customer solutions and faster time-to-market

The i.MX 6SoloX is supported by companion power management ICs (PMIC) MMPF0100 and MMPF0200.

i.MX 6 applications processors are part of NXP's EdgeVerse™ edge computing platform.

Data Sheet

Reference Manual

Product Details

Block Diagram

i.MX 6SoloX Applications Processor Block diagram

Get diagram PDF

Features

CPU Complex

1x Cortex-A9 up to 1 GHz
- 256 KB L2 cache
- 32 KB instruction and data caches
- NEON SIMD media accelerator
1x Cortex-M4 up to 200 MHz
- 16 KB instruction and data caches
- 64 KB TCM
- MPU and FPU

Multimedia

GPU 2D/3D
- Vivante GC400T
- 17Mtri/s 133Mpxl/s Open GL ES 2.0
Camera Interface
- 24-bit parallel CMOS sensor interface
- NTSC/PAL analog video input interface
PiXel Processing Pipeline (PXP)
- Image re-sizing, rotation, overlay and CSC

Memory

DDR
- 16/32-bit DDR3-800 and DDR3L-800
- 16/32-bit LPDDR2-800
NAND
- SLC/MLC, 62-bit ECC, ONFI2.2
- NOR
- 2x DDR Quad SPI
- 16/32-bit NOR Flash

Connectivity

2x 10/100/1000 Ethernet
- Hardware AVB for traffic shaping and enhanced packet prioritization
- Support for IEEE^{^®}1588
PCIe 2.0 (1 lane)
2x 8ch 12-bit ADC
3x USB 2.0 ports
- 2x HS OTG + PHY
- 1x HS Host HSIC
4x SD/MMC 4.5
5x SPI, 6x UART, 4x I²C, 5x I²S/SSI
FlexCAN
MLB 25/50

Display

Parallel RGB
LVDS

Advanced Power Management

Partial PMU integration
NXP^{^®} PF0200 PMIC

Security

Multicore unit includes for multi-core isolation and sharing
Resource Domain Controller (RDC)
Secure Messaging Unit (MU)
Hardware Semaphores
High Assurance Boot, cryptographic cipher engines, random number generator, and tamper detection

Package and Temperature

19 x 19 mm 0.8 mm BGA
17 x 17 mm 0.8 mm BGA (two ball map options)
14 x 14 mm 0.65 mm BGA
Extended Commercial (-20C to +105C)
Industrial (-40C to +105C)
Automotive (-40C to +125C), AEC-Q100

Design Resources

Design Files

3 design files

^Models
BSDL file for i.MX 6SoloX

ZIPRev 1Oct 28, 2015 00:00:0031.2 KBIMX6SX_BSDL
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^Models
i.MX 6SoloX IBIS Model files

ZIPRev 20160113Jan 11, 2017 00:00:00129239 KBIMX6SX_IBIS
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^{Printed Circuit Boards and Schematics}
i.MX6SX_400_Footprint_OrCard_symbol

ZIPRev 0Jul 7, 2015 00:00:0036.5 KBI.MX6SX-400-FOOTPRINT-ORCAD
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