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Package Version Package Name Package Description Reference Codes Issue Date
HBGA736 plastic thermal enhanced ball grid array package; 736 balls; heatsink 2009-08-14
HBGA520 plastic thermal enhanced ball grid array package; 520 balls; heatsink MS-034(JEDEC);144E(IEC 2008-06-03
HBGA624 plastic thermal enhanced ball grid array package; 624 balls; heatsink, 1 mm pitch, 35 mm x 35 mm x1.75 mm body 2008-11-17
HBGA432 plastic thermal enhanced ball grid array package; 432 balls; heatsink MS-034(JEDEC);144E(IEC 2009-08-14
HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink MS-034(JEDEC);144E(IEC 2009-06-09
HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink MS-034(JEDEC);144E(IEC 2010-01-06
HBGA543 plastic thermal enhanced ball grid array package; 543 balls; heatsink, 1 mm pitch, 27 mm x 27 mm x 1.73 mm body 2009-08-03
HBGA404 HBGA404, plastic thermal enhanced ball grid array; 404 balls; 1 mm pitch, 23 mm x 23 mm x 1.75 mm body MS-034(JEDEC);144E(IEC 2017-06-14
HBGA640 plastic thermal enhanced ball grid array package; 640 balls; heatsink MS-034D compliant(JEDEC 2009-10-19
HBGA360 plastic, thermal enhanced ball grid array package; 360 balls; heatsink MS-034(JEDEC);144E(IEC 2010-01-22
HBGA620 HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body MS-034 AAM-1(JEDEC 2016-02-01
HBGA448 HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body 2017-06-11
HBGA516 HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body PBGA-B516(JEDEC 2017-06-11
HBGA668 HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body HT-PBGA-B668(JEDEC 2017-06-11
HBGA689 HBGA689, plastic, thermal enhanced ball grid array; 689 balls; 1 mm pitch; 31 mm x 31 mm x 1.86 mm body HT-PBGA-B689(JEDEC 2017-06-11
HBGA352 plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm 2000-03-04
HBGA292 plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2002-02-27
HBGA256 plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink MS-034(JEDEC);144E(IEC 2003-03-17
HBGA420 plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink MS-034(JEDEC);144E(IEC 2003-03-17
HBGA504 plastic, thermal enhanced ball grid array package; 504 balls; 1.27 mm pitch; 35 mm x 35 mm x 0.9 mm body MS-034(JEDEC);144E(IEC 2003-03-17
HBGA600 plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body MS-034(JEDEC);144E(IEC 2003-03-17
HBGA456 plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink MS-034(JEDEC);144E(IEC 2009-08-14
HBGA1312 plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink MS-034(JEDEC);144E(IEC 2003-01-14
HBGA596 plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2003-01-14
HBGA388 plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body MS-034(JEDEC);144E(IEC 2001-12-11
HBGA960 plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink MS-034(JEDEC 2002-05-01
HBGA552 plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink 2002-11-13
HBGA584 plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink 2002-11-22
HBGA329 plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2001-10-30
HBGA564 plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2002-11-18
HBGA156 plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink MS-034(JEDEC 2003-03-06
HBGA672 plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink 2003-11-18
HBGA760 plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink MS-034(JEDEC 2005-08-19
HBGA256 plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink MS-034(JEDEC 2004-03-19
HBGA624 plastic, thermal enhanced ball grid array package; 624 balls; 1.27 mm pitch; 40 mm x 40 mm x 1.75 mm body MS-034(JEDEC 2005-09-22
HBGA456 plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2005-09-02
HBGA1092 plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2006-05-31
HBGA432 plastic thermal enhanced ball grid array package; 432 balls; body 35 x 35 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC 2006-06-21