i.MX 95 Applications Processor Family—High-Performance, Safety Enabled Platform with eIQ® Neutron NPU

  • Preproduction
  • This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.

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Product Details

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Block Diagram

i.MX 95 Applications Processor

iMX95

Features

Connectivity

  • 1x10GbE + 2x Gb Ethernet w/TSN; AVB and IEEE 1588 for sync and EEE
  • 1x USB 3.0 Type C with PHY + 1x USB 2.0 Type C with PHY
  • 5x CAN-FD
  • 8x UART/USART/Profibus, 8x I2C, 8x SPI, 2x I3C
  • 1x 8-ch, 12-bit ADC
  • 2x 32-pin FlexIO interfaces (camera, bus or serial I/O)
  • 2x PCIe Gen 3 1x lane

External Memory

  • Up to 6.4GT/s x32 LPDDR5/LPDDR4x (w/ Inline ECC)
  • 3x SD 3.0/ SDIO3.0/ eMMC5.1
  • 1x Octal SPI, including support for SPI NOR and SPI NAND memories

Graphics

  • 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL 3.0
  • 2D GPU

Display interfaces

  • 1x 333Mpixel/s MIPI-DSI (4-lane, 2.5 Gbps/lane) supporting 4kp30 or 3840x1440p60
  • Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)

Camera Interfaces

  • 500 Mpixel/s MIPI-CSI and ISP (2x 4-lane, 2.5 Gbps/lane) with PHY (1 mux with DSI)
  • Up to 2x4kp30, 4x1080p60, or 8x1080p30 cameras with MIPI virtual channels

Audio

  • 17x I2S TDM (32-bit @ 768KHz), SPDIF Tx/Rx, eARC Rx
  • 8 channel PDM microphone input
  • MQS: Medium Quality Sound output (sigma-delta modulator)

Operating Systems

  • Linux® OS
  • Android OS
  • FreeRTOS

Process

  • 16nm FinFET

Packaging

  • 19x19mm, 0.7mm pitch; and 15x15mm, 0.5mm pitch

Temp Range (Junction)

  • Automotive/Extended Industrial -40 °C to 105 °C

Documentation

Quick reference to our documentation types.

1 documents

Design Resources

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Software

2 software files

Note: For better experience, software downloads are recommended on desktop.

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