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Package Version Package Name Package Description Reference Codes Issue Date
WLCSP wafer level chip-scale package; 6 bumps; 0.65 x 0.44 x 0.27 mm 2015-05-06
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2013-11-04
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2012-07-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP Wafer level chip-size package; 6 bumps (3 x 2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
WLCSP Wafer level chip-size package; 18 bumps 2011-07-06
WLCSP Wafer level chip-size package; 24 bumps 2011-07-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-07
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-07
WLCSP Wafer level chip-size package; 24 bumps (5 x 5 - A1) ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
WLCSP Wafer level chip-size package; 25 bumps (5 x 5) ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
WLCSP Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm 2005-08-26
WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm 2008-11-11
WLCSP wafer level chip-size package; 16 bumps 2009-03-12
WLCSP Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm 2010-11-02
WLCSP Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm 2011-04-28
WLCSP Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm 2008-11-11
WLCSP Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm 2011-06-06
WLCSP Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm 2008-05-20
WLCSP Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm 2008-09-24
WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2011-04-28
WLCSP WLCSP18: wafer level chip-size package; 18 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
WLCSP WLCSP24: wafer level chip-size package; 24 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2008-08-15
WLCSP Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm 2011-06-06
WLCSP Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm 2009-07-06
WLCSP Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm 2008-10-10
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 11 bumps 2011-07-06
WLCSP Wafer level chip-size package; 8 bumps (3 x 3 - A1) 2011-07-06
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2007-09-03
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2006-09-23
WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2013-04-15
WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
WLCSP Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC 2010-10-18
WLCSP WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm ---(EIAJ);---(JEDEC);---(IEC 2013-11-04
WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2014-11-03
WLCSP wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm 2014-12-16
WLCSP wafer level chip-size package, 12 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-06-16
WLCSP wafer level chip-size package, 12 bumps 2011-07-28
WLCSP wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm ---(EIAJ);---(JEDEC);---(IEC 2013-02-26
WLCSP wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.205 mm x 1.605 mm x 0.272 mm body 2014-04-22
WLCSP wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included) 2015-07-21
WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
WLCSP wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) 2015-01-19
WLCSP wafer level chip-size package; 16 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-11-04
WLCSP wafer level chip-size package; 16 bumps 2012-01-10
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC 2011-06-09
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC 2011-06-10
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
WLCSP wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2013-04-02
WLCSP WLCSP12: wafer level chip-scale package; 12 bumps 2013-03-29
WLCSP WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-12-20
WLCSP Wafer level chip-size package; 9 bumps 2013-03-27
WLCSP wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 2014-02-14
WLCSP wafer level chip-scale package; 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-01-21
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-10-16
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
WLCSP wafer level chip-scale package; 39 balls ---(EIAJ);---(JEDEC);---(IEC 2013-06-06
WLCSP wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm 2015-10-05
WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-07-23
WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-09-29
WLCSP wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm 2015-08-17
WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included) 2014-11-19
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2014-07-02
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2014-07-03
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-07
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-20
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-03-25
WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2015-08-06
WLCSP Wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm 2010-01-19
WLCSP Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm 2007-10-17
WLCSP Wafer level chip-size package; 9 bumps; 1.66 X 1.71 X 0.6 mm 2008-06-12
WLCSP Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm 2006-12-15
WLCSP wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm ---(EIAJ);---(JEDEC);---(IEC 2013-03-07
WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-06
WLCSP WLCSP9: wafer level chip-size package; 9 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2014-10-09
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2015-04-17
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) 2015-03-13
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include) 2015-05-07
WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-25
WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2016-08-04
WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.03 mm x 0.94 mm x 0.5 mm body 2016-04-26
WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.31 mm x 0.94 mm x 0.5 mm body 2018-11-30
WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 0.4 mm pitch, 0.91 mm x 0.855 mm x 0.455 mm body (backside coating included) 2022-07-15
WLCSP4 WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included) 2017-08-22
WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.23 mm body 2018-11-20
WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.28 mm body 2019-06-24
WLCSP6 wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm 2016-11-24
WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.22 mm x 0.85 mm x 0.6 mm body 2017-06-11
WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.18 mm x 0.84 mm x 0.455 mm body (backside coating included) 2020-12-04
WLCSP6 WLCSP6, wafer level chip-size package; 6 terminals; 0.5 mm pitch; 1.39 mm x 0.89 mm x 0.465 mm body 2021-12-06
WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body 2017-03-03
WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) 2018-08-08
WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included) 2018-03-06
WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included) 2017-09-09
WLCSP12 WLCSP12, wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.97 mm x 1.42 mm x 0.525 mm body 2018-06-19
WLCSP12 wafer level chip-scale package, 12 bumps 2016-03-02
WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included) 2017-01-11
WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included) 2017-04-24
WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included) 2017-10-23
WLCSP wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included) 2015-08-11
WLCSP16 WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body 2018-02-09
WLCSP16 wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included) 2016-08-29
WLCSP16 WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included) 2018-03-12
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.56 mm body NON-JEDEC(JEDEC 2017-06-11
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body 2017-06-11
WLCSP20 wafer level chip-scale package, 20 bumps 2016-04-26
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.32 mm body 2017-06-11
WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) 2017-01-19
WLCSP25 WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2017-12-04
WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body 2018-05-24
WLCSP24 WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included) 2017-06-22
WLCSP25 wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body 2015-10-05
WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm 2017-05-12
WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included) 2017-05-12
WLCSP25 wafer level chip-scale package, 25 balls; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2018-08-03
WLCSP34 wafer level chip-scale package, 34 bumps, 0.4 mm pitch, 2.45 mm x 2.87 mm x 0.38 mm body 2016-08-08
WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.35 mm pitch; 2.46 mm x 2.37 mm x 0.56 mm body 2017-06-11
WLCSP36 wafer level chip-scale package; 36 bumps; 2.07 mm x 2.07 mm x 0.42 mm body 2016-04-26
WLCSP12 WLCSP12, wafer level chip scape package, 12 terminals, 1.58 mm x 2.15 mm x 0.22 mm body 2010-09-27
WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.22 mm body 2013-07-16
WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.17 mm body 2013-07-16
WLCSP49 WLCSP49, wafer level chip-size package; 49 terminals; 0.054 mm pitch; 3.14 mm x 2.92 mm x 0.56 mm body 2017-06-11
WLCSP wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included) 2015-06-11
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included) 2016-04-26
WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.5 mm body (backside coating included) 2019-04-26
WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included) 2019-04-16
WLCSP WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included) 2017-01-06
WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.3 mm x 3.3 mm x 0.525 mm body (Backside coating included) 2018-08-22
WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 2.915 mm x 3.142 mm x 0.564 mm body 2018-04-20
WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 3 mm x 2.9 mm x 0.525 mm body (backside coating included) 2021-12-23
WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm 2015-07-21
WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included) 2015-07-21
WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 2016-04-26
WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm 2016-04-26
WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.525 mm 2016-04-26
WLCSP49 wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm 2016-08-09
WLCSP wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm 2016-04-26
WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm 2016-07-11
WLCSP wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm 2016-12-06
WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.25 mm pitch, 0.7 mm x 0.45 mm x 0.23 mm body 2018-08-23
WLCSP99 wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm 2015-06-26
WLCSP wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included) 2015-10-09
WLCSP29 WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body 2017-06-14
WLCSP WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included) 2017-01-11
WLCSP100 WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body 2018-03-06
WLCSP11 wafer level chip-scale package, 11 bumps 2016-03-02
WLCSP8 wafer level chip-scale package, 8 bumps 2016-03-02
WLCSP6 wafer level chip-scale package, 6 bumps 2016-03-02
WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps, 0.28 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2015-08-17
WLCSP42 wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included) 2016-09-01
WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included) 2016-04-26
WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 2016-04-26
WLCSP WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-07-28
WLCSP42 WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 2.86 mm x 2.46 mm x 0.525 mm body (backside coating included) 2020-05-13
WLCSP42 WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 3.02 mm x 2.72 mm x 0.525 mm body (backside coating included) 2020-12-03
WLCSP WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body 2016-08-08
WLCSP WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body 2017-02-23
WLCSP wafer level chip-scale package, 46 bumps 2016-03-02
WLCSP6 WLCSP6, wafer level chip-scale package, 6 bumps, 0.19 mm pitch, 0.57 mm x 0.43 mm x 0.28 mm body 2016-04-25
WLCSP31 wafer level chip-scale package, 31 bumps 2016-04-26
WLCSP31 wafer level chip-scale package, 31 bumps 2016-03-02
WLCSP120 WLCSP120, wafer level chip-size package; 120 terminals; 0.4 mm pitch; 5.28 mm x 5.29 mm x 0.6 mm body NON-JEDEC(JEDEC 2017-06-11
WLCSP142 WLCSP142, , wafer level chip-size package; 142 terminals; 0.4 mm pitch; 5.58 mm x 4.84 mm x 0.6 mm body 2017-06-11
WLCSP143 WLCSP143, , wafer level chip-size package; 143 terminals; 0.4 mm pitch; 5.55 mm x 6.44 mm x 0.6 mm body 2017-06-11
WLCSP169 WLCSP169, wafer level chip-size package; 169 terminals; 0.4 mm pitch; 5.5 mm x 5.63 mm x 0.6 mm body 2017-06-11
WLCSP173 WLCSP173, wafer level chip-size package; 173 terminals; 0.5 mm pitch; 7.74 mm x 7.9 mm x 0.6 mm body 2017-06-11
WLCSP211 WLCSP211, , wafer level chip-size package; 211 terminals; 0.5 mm pitch; 9.33 mm x 7.91 mm x 0.6 mm body 2017-06-11
WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.98 mm x 3.07 mm x 0.6 mm body 2017-06-11
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body (backside coating included) 2018-11-01
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-30
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body 2018-12-04
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.79 mm x 2.59 mm x 0.525 mm body 2019-04-18
WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 3.064 mm x 3.064 mm x 0.545 mm body 2016-01-05
WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.674 mm x 2.822 mm x 0.564 mm body 2016-04-15
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-12-20
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-12-08
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-09-18
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body 2017-09-18
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included) 2018-06-20
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-01
WLCSP35 WLCSP35, , wafer level chip-size package; 35 terminals; 0.4 mm pitch; 2.99 mm x 2.53 mm x 0.6 mm body 2017-06-11
WLCSP35 WLCSP35, wafer level chip-size package; 35 terminals; 0.4 mm pitch; 3 mm x 2.16 mm x 0.525 mm body 2021-11-23
WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.32 mm x 3.35 mm x 0.6 mm body 2017-06-11
WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.38 mm x 3.48 mm x 0.32 mm body 2017-06-11
WLCSP64 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) 2018-08-02
WLCSP80 WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.6 mm body 2017-06-11
WLCSP80 WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.34 mm body NON-JEDEC(JEDEC 2017-06-11
WLCSP89 wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body 2016-09-05
WLCSP75 WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body 2017-06-11
WLCSP25 wafer level chip-scale package, 25 bumps 2016-04-26
WLCSP wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm 2016-10-04
WLCSP8 Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm 2016-10-04
WLCSP7 WLCSP7, , wafer level chip-size package; 7 terminals; 0 mm pitch; 0.38 mm x 1.47 mm x 0.38 mm body 2017-06-11
WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.33 mm x 6.62 mm x 0.56 mm body 2017-06-11
WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.94 mm x 6.94 mm x 0.56 mm body 2017-06-11
WLCSP47 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 2016-08-01
WLCSP48 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included) 2016-10-04
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.5 mm body 2017-12-11
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-11
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.50 mm body 2017-12-19
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-08
WLCSP56 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) 2016-08-09
WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included) 2019-01-23
WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body 2017-03-08
WLCSP214 WLCSP214, wafer level chip-scale package, 214 terminals, 0.5 mm pitch, 9.418 mm x 7.918 mm x 0.55 mm body 2018-03-28
WLCSP56 WLCSP56, wafer level chip scale package, 56 terminals, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body 2018-02-08
WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.495 mm body (backside coating included) 2020-04-06
WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.365 mm body (backside coating included) 2019-09-17
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body 2018-01-22
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body 2017-02-21
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body 2018-04-27
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body (backside coating included) 2019-07-04
WLCSP41 WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body 2017-06-14
WLCSP40 WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 2017-09-13
WLCSP72 WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body 2017-10-05
WLCSP8 WLCSP8, wafer level chip-scale package, 8 terminals, 0.205 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2018-03-07
WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body 2018-02-12
WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included) 2018-03-14
WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.49 mm body (backside coating included) 2018-05-16
WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.325 mm body (backside coating included) 2019-11-25
WLCSP12 WLCSP12, wafer level chip scale package; 12 terminals, 0.5 mm pitch, 2.06 mm x 2.018 mm x 0.6 mm body 2019-06-11
WLCSP36 WLCSP36, wafer level chip scale package, 36 terminals, 0.3 mm pitch, 1.895 mm x 1.895 mm x 0.38 mm body (backside coating included) 2019-02-25
WLCSP114 WLCSP114, wafer level chip scale package, 114 terminals, 0.35 mm pitch, 4.235 mm x 4.235 mm x 0.49 mm body (backside coating included) 2020-04-24
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 3.15 mm x 2.89 mm x 0.38 mm body 2021-05-28
WLCSP91 WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.263 mm body 2019-07-08
WLCSP91 WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.129 mm body 2019-07-08
WLCSP48 WLCSP48, wafer level chip scale package, 48 terminals with gold bump, 0.15 mm pitch, 3.931 mm x 2.983 mm x 0.129 mm body 2019-07-15
WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.25 mm pitch, 1.185 mm x 0.935 mm x 0.22 mm body 2019-10-24
WLCSP4 WLCSP4, wafer level chip scale package, 4 terminals; 0.6 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) 2019-08-09
WLCSP9 WLCSP9, wafer level chip scale package, 9 terminals; 0.3 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) 2019-08-08
WLCSP70 WLCSP70, wafer level chip scale package, 70 terminals, 0.4 mm pitch, 4.16 mm x 2.96 mm x 0.525 mm body (backside coating included) 2020-05-20
WLCSP49 WLCSP49, wafer level chip scale package, 49 terminals, 0.35 mm pitch, 2.56 mm x 2.46 mm x 0.365 mm body (backside coating included) 2020-04-20
WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.55 mm x 1.18 mm x 0.455 mm body (backside coating included) 2021-03-11
WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.545 mm x 1.26 mm x 0.495 mm body 2020-09-07
WLCSP141 WLCSP141, wafer level chip scale package, 141 terminals, 0.35 mm pitch, 4.525 mm x 4.525 mm x 0.49 mm body (back side coating included) 2020-07-13
WLCSP76 WLCSP76, wafer level chip scale package, 76 terminals, 3.95 mm x 3.565 mm x 0.495 mm body (backside coating included) 2020-06-10
WLCSP83 WLCSP83, wafer level chip scale package, 83 terminals, 0.4 mm pitch, 4.6 mm x 4.2 mm x 0.75 mm body 2020-09-16
WLCSP74 WLCSP74, wafer level chip scale package, 74 terminals, 0.4 mm pitch, 3.46 mm x 4.675 mm x 0.76 mm body 2020-10-07
WLCSP79 WLCSP79, wafer level chip scale package, 79 terminals, 0.35 mm pitch, 3.58 mm x 3.185 mm x 0.37 mm body (backside coating included) 2021-03-31
WLCSP140 WLCSP140, wafer level chip-size package; 140 terminals; 0.3 mm pitch; 4.385 mm x 4.96 mm x 0.455 mm body 2022-01-13
WLCSP16 WLCSP16, wafer level chip scale package, 16 terminals, 0.35 mm pitch, 1.41 mm x 1.41 mm x 0.49 mm body (backside coating included) 2021-01-12
WLCSP103 WLCSP103, wafer level chip scale package, 103 terminals, 0.33 mm pitch, 4.05 mm x 3.16 mm x 0.38 mm body 2021-08-20
WLCSP70 WLCSP70, wafer level chip scale package, 70 terminals, 0.35 mm pitch, 3.64 mm x 3.16 mm x 0.49 mm body (backside coating included) 2021-06-01
WLCSP wafer level chip-size package; 5 bumps (2-1-2) 2007-05-25
WLCSP wafer level chip-size package; 10 bumps (4-2-4) 2010-02-11
WLCSP wafer level chip-size package; 15 bumps (6-3-6) 2010-02-11
WLCSP wafer level chip-size package; 17 bumps (6-5-6) 2012-05-03
WLCSP25 wafer level chip-size package; 25 bumps 2012-02-13
WLCSP wafer level chip-size package; 25 bumps (5 x 5) 2010-02-11
WLCSP30 wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2016-01-25
WLCSP4 wafer level chip-scale package; 4 bumps; 0.83 x 0.78 x 0.53 mm (backside coating included) 2016-04-13
WLCSP wafer level chip-size package; 5 bumps (2-1-2) 2010-02-11
WLCSP wafer level chip-size package; 6 bumps 2012-01-11